• Opto-Electronic Engineering
  • Vol. 40, Issue 5, 138 (2013)
LIAO Jiasheng1、2、*, GONG Yan1, YUAN Wenquan1, and LUO Cong1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3969/j.issn.1003-501x.2013.05.020 Cite this Article
    LIAO Jiasheng, GONG Yan, YUAN Wenquan, LUO Cong. Analysis of Curing Stress Magnitude about Low Stress Optical Structure Adhesives under Stable Temperature[J]. Opto-Electronic Engineering, 2013, 40(5): 138 Copy Citation Text show less

    Abstract

    Based on a special bonding structure, a new experiment device was designed to research the relation of low stress optical structure adhesives between internal stress and time. Through the experiment based on electrical method,the structure’s curing property was oppositely deduced by monitoring deformation of the bonded object (steel piece) core. Firstly, the theoretical law of structure adhesives’ curing process is analyzed. Then, two low stress structure adhesives 3140RTV and UV295 were chosen to be tested for a week, and the curve gotten from the experiment was analyzed. Taking advantage of Finite Element Method (FEM) software with a little theoretical hypothesis, influence of residue stress of the two structure adhesives on steel piece was calculated, and the result answers which structure adhesive is better. The calculation result and the experiment curves’ analysis further explain the purpose and significance of the experiment.
    LIAO Jiasheng, GONG Yan, YUAN Wenquan, LUO Cong. Analysis of Curing Stress Magnitude about Low Stress Optical Structure Adhesives under Stable Temperature[J]. Opto-Electronic Engineering, 2013, 40(5): 138
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