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    Journals >Acta Optica Sinica >Volume 39 >Issue 10 >Page 1023001 > Article
    • Acta Optica Sinica
    • Vol. 39, Issue 10, 1023001 (2019)
    Thermal Analysis of High-Power LED Lens
    Dandan Xu1 and Xuegong Hu1、2、*
    Author Affiliations
  • 1Research Center for Heat and Mass Transfer, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190, China
  • 2University of Chinese Academy of Sciences, Beijing 100049, China
    • show less
    DOI: 10.3788/AOS201939.1023001 Cite this Article Set citation alerts
    Dandan Xu, Xuegong Hu. Thermal Analysis of High-Power LED Lens[J]. Acta Optica Sinica, 2019, 39(10): 1023001 Copy Citation Text show less
    References

    [1] Luo X B, Hu R, Liu S et al. Heat and fluid flow in high-power LED packaging and applications[J]. Progress in Energy and Combustion Science, 56, 1-32(2016). http://www.sciencedirect.com/science/article/pii/S0360128515300253

    [2] Weng C J. Advanced thermal enhancement and management of LED packages[J]. International Communications in Heat and Mass Transfer, 36, 245-248(2009). http://www.sciencedirect.com/science/article/pii/S0735193308002558

    [3] Li H, Liang J Q, Liang Z Z et al. Thermal analysis of AlGaInP-based LED microarray[J]. Acta Optica Sinica, 36, 0123001(2016).

    [4] Chen H T, Tan S C, Hui S Y. Color variation reduction of GaN-based white light-emitting diodes via peak-wavelength stabilization[J]. IEEE Transactions on Power Electronics, 29, 3709-3719(2014). http://ieeexplore.ieee.org/document/6603258/

    [5] Chen H, Zhou X L, Tang W et al. Thermal design of high power remote phosphor white LED package[J]. Chinese Journal of Luminescence, 38, 97-102(2017).

    [6] Zou S P, Wu B X, Wan Z P et al. Effect of current-temperature stress on the reliability of GaN LED[J]. Chinese Journal of Luminescence, 37, 124-129(2016).

    [7] Li J S, Yang Q X, Niu P J et al. Analysis of thermal field on integrated LED light source based on COMSOL multi-physics finite element simulation[J]. Physics Procedia, 22, 150-156(2011). http://www.sciencedirect.com/science/article/pii/S187538921100678X

    [8] Liou B H, Chen C M, Horng R H et al. Improvement of thermal management of high-power GaN-based light-emitting diodes[J]. Microelectronics Reliability, 52, 861-865(2012). http://www.sciencedirect.com/science/article/pii/S0026271411001260

    [9] Juntunen E, Tapaninen O, Sitomaniemi A et al. Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 3, 1148-1154(2013). http://ieeexplore.ieee.org/document/6523062/

    [10] Maaspuro M, Tuominen A. Thermal analysis of LED spot lighting device operating in external natural or forced heat convection[J]. Microelectronics Reliability, 53, 428-434(2013). http://www.sciencedirect.com/science/article/pii/S0026271412004799

    [11] Fei X, Qian K Y, Luo Y. Junction temperature measurement and luminous properties research of high-power LED[J]. Journal of Optoelectronics·laser, 19, 289-292, 299(2008).

    [12] Liu Y B, Huang X M, Liu G H. Research of heat release technology of based on power-LED[J]. China Illuminating Engineering Journal, 19, 69-73(2008).

    [13] Zhu X P, Yu G Y, Ding S S et al. Transient temperature field and thermal stress of high power LED[J]. Opto-Electronic Engineering, 38, 132-137(2011).

    [14] Chen H T, Chen F C, He Y et al. Analysis of thermal characteristics of a multichip light-emitting diodes device[J]. Chinese Journal of Luminescence, 39, 751-756(2018).

    [15] Chen Q, Ma Y P, Yu X J et al. Phosphor temperature overestimation in high-power light-emitting diode by thermocouple[J]. IEEE Transactions on Electron Devices, 64, 463-466(2017). http://ieeexplore.ieee.org/document/7801089/

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    Dandan Xu, Xuegong Hu. Thermal Analysis of High-Power LED Lens[J]. Acta Optica Sinica, 2019, 39(10): 1023001
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