• Chinese Journal of Quantum Electronics
  • Vol. 40, Issue 6, 879 (2023)
ZHANG Kai1、2、3, TAN Fengfu2、3、*, HOU Zaihong2、3, HUANG Zhigang2、3, QIU Chenxiang2、3, ZHANG Silong2、3, and WU Yi1、2、3
Author Affiliations
  • 1School of Environmental Science and Optoelectronic Technology, University of Science and Technology of China, Hefei 230026, China
  • 2Key Laboratory of Atmospheric Optics, Anhui Institute of Optics and Fine Mechanics, HFIPS, Chinese Academy of Sciences, Hefei 230031, China
  • 3Advanced Laser Technology Laboratory of Anhui Province, Hefei 230037, China
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    DOI: 10.3969/j.issn.1007-5461.2023.06.008 Cite this Article
    Kai ZHANG, Fengfu TAN, Zaihong HOU, Zhigang HUANG, Chenxiang QIU, Silong ZHANG, Yi WU. Simulation analysis of thermal effects of protective sampling panel for array target[J]. Chinese Journal of Quantum Electronics, 2023, 40(6): 879 Copy Citation Text show less
    Structural representation of array target and sampling holes
    Fig. 1. Structural representation of array target and sampling holes
    Schematic diagram of laser position and three-dimension distribution diagram of laser spot.(a) Laser position; (b) Laser spot distribution
    Fig. 2. Schematic diagram of laser position and three-dimension distribution diagram of laser spot.(a) Laser position; (b) Laser spot distribution
    The curve of panel equivalent stress with peak power density. (a) Aluminium alloy; (b) Red copper
    Fig. 3. The curve of panel equivalent stress with peak power density. (a) Aluminium alloy; (b) Red copper
    The curve of tolerance peak power density with the thickness of the panel
    Fig. 4. The curve of tolerance peak power density with the thickness of the panel
    Schematic diagram of temperature distribution on protective sampling panel
    Fig. 5. Schematic diagram of temperature distribution on protective sampling panel
    Schematic diagram of heat pipe arrangement. (a) Horizontal arrangement; (b) Cross arrangement
    Fig. 6. Schematic diagram of heat pipe arrangement. (a) Horizontal arrangement; (b) Cross arrangement
    Curve of equivalent of panel with peak power density under different interfacial heat transfer coefficients.(a) Horizontal arrangement; (b) Cross arrangement
    Fig. 7. Curve of equivalent of panel with peak power density under different interfacial heat transfer coefficients.(a) Horizontal arrangement; (b) Cross arrangement
    Curve of equivalent stress of panel with interfacial heat transfer coefficient
    Fig. 8. Curve of equivalent stress of panel with interfacial heat transfer coefficient
    Curve of equivalent stress of panel with peak power density with different heat pipe arrangement
    Fig. 9. Curve of equivalent stress of panel with peak power density with different heat pipe arrangement
    ParameterAluminum alloyCopper alloy
    Destiny/kg·m327508306
    Youngs modulus/MPa450001.1×105
    Poisson's ratio0.330.34
    Isotropic thermal120400
    Coefficient of thermal2.1×10-51.8×10-5
    Table 1. Material property
    Kai ZHANG, Fengfu TAN, Zaihong HOU, Zhigang HUANG, Chenxiang QIU, Silong ZHANG, Yi WU. Simulation analysis of thermal effects of protective sampling panel for array target[J]. Chinese Journal of Quantum Electronics, 2023, 40(6): 879
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