Four microchannel models with symmetrical and equidistant grooves are proposed for the heat dissipation of electronic devices. The effects of groove shape and layout on microchannel flow and heat transfer performance under different Reynolds numbers (Re) were studied by three-dimensional numerical simulation. The results show heat transfer performance of circular groove is only inferior to that of the triangular groove, while trapezoid and rectangular grooves are poor. The pressure drop of triangular groove is the largest, followed by circular groove, and the pressure loss difference between trapezoid and rectangular groove is small, but the pressure drop is almost the same for the grooves with the same shape and different layout, which indicates that changing the groove layout to improve performance will not produce additional pressure loss. Combining with the characteristics of heat transfer and pressure drop, the thermal performance coefficient (TPC) of microchannel increases first and then decreases, so the optimal TPC is obtained with the triangular groove at Re=600, while the TPC of the equidistant circular groove exceeds that of the triangular groove at Re=900.