Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

Ying Liu; Wei Xiong; Da Wei Li; Yao Lu; Xi Huang; Huan Liu; Li Sha Fan; Lan Jiang; Jean-Francois Silvain; Yong Feng Lu

doi:10.1088/2631-7990/ab17f7

Journals >International Journal of Extreme Manufacturing >Volume 1 >Issue 2 >Page 25001 > Article

International Journal of Extreme Manufacturing
Vol. 1, Issue 2, 25001 (2019)

Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures

Ying Liu^1、*, Wei Xiong², Da Wei Li¹, Yao Lu¹, Xi Huang¹, Huan Liu², Li Sha Fan¹, Lan Jiang³, Jean-Francois Silvain⁴, and Yong Feng Lu¹

Author Affiliations

¹Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, United States of America

²Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan 430074, People’s Republic of China

³School of Mechanical Engineering, Beijing Institute of Technology,Beijing, 100081, People’s Republic of China

⁴Institut de Chimie de la Matière Condensée de Bordeaux, Avenue du Docteur Albert Schweitzer, F-33608 Pessac Cedex, France

show less

DOI: 10.1088/2631-7990/ab17f7 Cite this Article

Ying Liu, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean-Francois Silvain, Yong Feng Lu. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures[J]. International Journal of Extreme Manufacturing, 2019, 1(2): 25001 Copy Citation Text

show less

References

Download Citation

Save the article for my favorites

Paper Information