• International Journal of Extreme Manufacturing
  • Vol. 1, Issue 2, 25001 (2019)
Ying Liu1、*, Wei Xiong2, Da Wei Li1, Yao Lu1, Xi Huang1, Huan Liu2, Li Sha Fan1, Lan Jiang3, Jean-Francois Silvain4, and Yong Feng Lu1
Author Affiliations
  • 1Department of Electrical and Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, United States of America
  • 2Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan 430074, People’s Republic of China
  • 3School of Mechanical Engineering, Beijing Institute of Technology,Beijing, 100081, People’s Republic of China
  • 4Institut de Chimie de la Matière Condensée de Bordeaux, Avenue du Docteur Albert Schweitzer, F-33608 Pessac Cedex, France
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    DOI: 10.1088/2631-7990/ab17f7 Cite this Article
    Ying Liu, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean-Francois Silvain, Yong Feng Lu. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures[J]. International Journal of Extreme Manufacturing, 2019, 1(2): 25001 Copy Citation Text show less

    Abstract

    Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 Sm-1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ~105Sm-1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.
    Ying Liu, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean-Francois Silvain, Yong Feng Lu. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures[J]. International Journal of Extreme Manufacturing, 2019, 1(2): 25001
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