• Microelectronics
  • Vol. 52, Issue 4, 663 (2022)
YU Wenting, TANG Shuting, XIN Zehui, and WANG Debo
Author Affiliations
  • [in Chinese]
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    DOI: 10.13911/j.cnki.1004-3365.210391 Cite this Article
    YU Wenting, TANG Shuting, XIN Zehui, WANG Debo. 3-D Equivalent Circuit Model of MEMS Microwave Power Sensors[J]. Microelectronics, 2022, 52(4): 663 Copy Citation Text show less
    References

    [1] SONG X, LI J, FAN Y, et al. Six-port direct modulator with carrier suppression technology for high-speed high-frequency wireless communications [J]. IEEE Microw Wirel Compon Lett, 2017, 27(8): 745-747.

    [2] ZHANG F, PAN S. Microwave photonic signal generation for radar applications [C]// IEEE iWEM. Nanjing, China. 2016: 1-3.

    [3] NAKARMI B, CHEN H, WON Y H, et al. Microwave frequency generation, switching, and controlling using single-mode FP-LDs [J]. J Light Tech, 2018, 36(19): 4273-4281.

    [5] YAN J B, LIAO X P. Research on the response time of indirect-heating microwave power sensor [J]. IEEE Sensors J, 2016, 16(13): 5270-5276.

    [6] ZHANG Z, MA Y. DC-25 GHz and low-loss MEMS thermoelectric power sensors with floating thermal slug and reliable back cavity based on GaAs MMIC technology [J]. Micromachines, 2018, 9(4): 154.

    [10] WANG D B, LIAO X P. A voltage source model on thermoelectric power sensor based on MEMS technology [J]. Microsyst Technol, 2011, 17(8): 1343-1349.

    [11] MILANOVIC V, HOPCROFT M, ZINCKE C A, et al. Optimization of CMOS MEMS microwave power sensors [C]// IEEE ISCAS. Orlando, FL, USA. 1999: 144-147.

    [12] LIU T, LIAO X P. Simulation of characteristic of a thermoelectric power sensor based on MEMS technology [J]. Key Engineer Mater, 2012, 503: 91-96.

    [13] YI Z X, LIAO X P. A 3D model of the thermoelectric microwave power sensor by MEMS technology [J]. Sensors, 2016, 16(6): 921.

    [14] HAN J Z, LIAO X P. Analytical and electrical modeling of a MEMS thermoelectric microwave power sensor [J]. J Micromech Microeng, 2016, 26(9): 094001.

    [15] LI J H, LIAO X P, CHU C. Electromagnetic- thermal-electric analysis of indirectly-heated RF MEMS power sensors with different terminal resistor dimensions [J]. IEEE Sensors J, 2021, 21(4): 4342-4349.

    YU Wenting, TANG Shuting, XIN Zehui, WANG Debo. 3-D Equivalent Circuit Model of MEMS Microwave Power Sensors[J]. Microelectronics, 2022, 52(4): 663
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