Preparation of solder pads by selective laser scanning

Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo

doi:10.3788/COL20090703.0217

Journals >Chinese Optics Letters >Volume 7 >Issue 3 >Page 03217 > Article

Chinese Optics Letters
Vol. 7, Issue 3, 03217 (2009)

Preparation of solder pads by selective laser scanning

Wenqing Shi^1、2, Yongqiang Yang¹, Yanlu Huang¹, Guoqiang Wei¹, and Wei Guo¹

Author Affiliations

¹School of Mechanical &

²Automotive Engineering, South China University of Technology, Guangzhou 5106402 College of Science, Guangdong Ocean University, Zhanjiang 524088

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DOI: 10.3788/COL20090703.0217 Cite this Article Set citation alerts

Wenqing Shi, Yongqiang Yang, Yanlu Huang, Guoqiang Wei, Wei Guo. Preparation of solder pads by selective laser scanning[J]. Chinese Optics Letters, 2009, 7(3): 03217 Copy Citation Text

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References

[1] K. Kordás, A. E. Pap, G. Tóth, M. Pudas, J. Jaaskelainen, A. Uusimaki, and J. Vahakangas, Opt. Lasers Eng. 44, 112 (2006).

[2] Y. Tian, C. Wang, and X. Zhang, Mater. Sci. Technol. (in Chinese) 10, 136 (2002).

[3] H. Dürr, R. Pilz, and N. S. Eleser, Computers in Industry 39, 35 (1999).

[4] Y. Shang, “Study on the microstructure, properties and interfacial reaction of Sn based lead-free solder" (in Chinese) PhD Thesis (Jilin University, June 2007) p.3.

[5] L. Yao, S. Xue, P. Wang, and L. Liu, Trans. China Welding Institution (in Chinese) 26, (10) 90 (2005).

[6] S. Xue, L. Yao, Z. Han, and L. Liu, Trans. China Welding Institution (in Chinese) 26, (12) 39 (2005).

[7] Y. Chen, Y. Miao, L. Li, and L. Wu, Chinese J. Lasers (in Chinese) 34, 1716 (2007).

[8] N. H. Rizvi and P. Apte, J. Mater. Process. Technol. 127, 206 (2002).

[9] W. Shi and Y. Yang, Laser Technol. (in Chinese) 32, 308 (2008).

[10] Y. Tian and C. Wang, Welding and Joining (in Chinese) (6) 5 (2002).

Data from CrossRef

[1] Anil Kunwar, Shengyan Shang, Peter R?back, Yunpeng Wang, Julien Givernaud, Jun Chen, Haitao Ma, Xueguan Song, Ning Zhao. Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints. Microelectronics Reliability, 80, 55(2018).

[2] R. Pawlak, M. Tomczyk, M. Walczak. The favorable and unfavorable effects of oxide and intermetallic phases in conductive materials using laser micro technologies. Materials Science and Engineering: B, 177, 1273(2012).

Wenqing Shi, Yongqiang Yang, Yanlu Huang, Guoqiang Wei, Wei Guo. Preparation of solder pads by selective laser scanning[J]. Chinese Optics Letters, 2009, 7(3): 03217

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