Preparation of solder pads by selective laser scanning

Wenqing Shi; Yongqiang Yang; Yanlu Huang; Guoqiang Wei; Wei Guo

doi:10.3788/COL20090703.0217

Journals >Chinese Optics Letters >Volume 7 >Issue 3 >Page 03217 > Article

Chinese Optics Letters
Vol. 7, Issue 3, 03217 (2009)

Preparation of solder pads by selective laser scanning

Wenqing Shi^1、2, Yongqiang Yang¹, Yanlu Huang¹, Guoqiang Wei¹, and Wei Guo¹

Author Affiliations

¹School of Mechanical &

²Automotive Engineering, South China University of Technology, Guangzhou 5106402 College of Science, Guangdong Ocean University, Zhanjiang 524088

show less

DOI: 10.3788/COL20090703.0217 Cite this Article Set citation alerts

Wenqing Shi, Yongqiang Yang, Yanlu Huang, Guoqiang Wei, Wei Guo. Preparation of solder pads by selective laser scanning[J]. Chinese Optics Letters, 2009, 7(3): 03217 Copy Citation Text

show less

Cited By

Article index updated: Feb. 24, 2023

Citation counts are provided from Web of Science. The counts may vary by service, and are reliant on the availability of their data.

The article is cited by 4 article(s) from Web of Science.

Wenqing Shi, Yongqiang Yang, Yanlu Huang, Guoqiang Wei, Wei Guo. Preparation of solder pads by selective laser scanning[J]. Chinese Optics Letters, 2009, 7(3): 03217

Download Citation

Set citation alerts for the article

Tools

Set citation alerts for the article

Save the article for my favorites

Paper Information