• Infrared and Laser Engineering
  • Vol. 36, Issue 5, 696 (2007)
[in Chinese]*, [in Chinese], [in Chinese], [in Chinese], [in Chinese], and [in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Recent progress of the 3rd generation infrared FPAs[J]. Infrared and Laser Engineering, 2007, 36(5): 696 Copy Citation Text show less
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    [2] SHIN S H,ARIAS J M,ZANDIAN M,et al.Enhanced arsenic diffusion and activation in HgCdTe[J]J Electron Mater,1995,24:609.

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    [4] DE LYON T J,RAJAVEL R D,JENSEN J E,et al.Heteroepitaxy of HgCdTe(112) infrared detector structures on Si (112) substrates by molecular beam epitaxy[J].J Electron Mater,1996,25:1341.

    [5] ROGALSKI A.Dual-band infrared detectors[C]// Proceedings of SPIE,Photodetectors:Materials and Devices V,2000,3948:17-30.

    [6] JOHNSON S M,Ames J B,AHLGREN W L,et al.Long Wavelength Semiconductor Devices,Materials and Processes,Materials Research Society Symposium Procd[C]//1991,216:141-149.

    [8] WU Jun,WU Yan,CHEN Lu,et al.Sticking coefficient of as in molecular beam epitaxy of HgCdTe[J].Journal of Infrared and Millimeter Waves,2002,21(5):347-350.

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    [1] Luo Shikui, Cheng Guimei. Thermal adapter of HgCdTe large plane arrays detector based on carbon fiber with high heat conductivity used in infrared space camera[J]. Infrared and Laser Engineering, 2016, 45(7): 704001

    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Recent progress of the 3rd generation infrared FPAs[J]. Infrared and Laser Engineering, 2007, 36(5): 696
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