[1] Jaing C C，Cheng M H，Chen J S，et al. Studying layer uniformity of sputter coatings by intensity distribution of plasma spectrum [J]. Applied Surface Science(S0169-4332)，2001，169/170：649-653.
[2] Wang Feiling，Crocker R，Faber R. Large-area Uniformity in Evaporation Coating through a New Form of Substrate Motion [C]//Manufacturing Contest and Large Area Coatings，Tucson，AZ，June 6，2010：1-3.
[3] A.min V，Gubanova L A，Putilin é S. Increasing the coating-uniformity zone when insulators are thermally evaporated in vacuum [J]. J.Opt.Technol(S1070-9762)，2006，73(8)：555-558.
[4] Arkwright J，Underhill I，Pereira N，et al. Deterministic control of thin film thickness in physical vapor deposition systems using a multi-aperture mask [J]. Optics Express(S1094-4087)，2005，13(7)：2731-2741.
[5] Lee C C，Chuang K P，Wu J Y. Thickness distribution of thin films deposited by ion beam sputtering [C]//Deposition of Optical Coating，Banff，Canada，July 15，2001：1-4.
[6] Macleod H A. Thin-Film optical filters，3rd edition [M].Bristol and Philadelphia：Institute of Physics Publishing，2001，488.
[7] WANG Jian-guo，SHAO Jian-da，YI Kui，et al. Layer uniformity of glancing angle deposition [J].Vacuum(S0022-5355)，2005，78：107-111.
[8] Kotlikov E N，Prokashev V N，Ivanov V A，et al. Thickness uniformity of films deposited on rotating substrates [J]. J.Opt.Technol(S1070-9762)，2009，76(2)：100-103.
[10] Oliver J B，Talbot D. Optimization of deposition uniformity for lager-aperture national Ignition Facility substrates in a planetary rotation system [J]. Appl. Opt(S1559-128X)，2006，45(13)：3097-3105.
