[2] WALWADKAR S S,CHO J. Evaluation of die stress in MEMS packaging: experimental and theoretical approaches[J]. IEEE Transactions on Components & Packaging Technologies, 2006,29(4):735-742.
WALWADKAR S S,CHO J. Evaluation of die stress in MEMS packaging: experimental and theoretical approaches[J]. IEEE Transactions on Components & Packaging Technologies, 2006,29(4):735-742.
[3] WALWADKAR S S,CHO J,FARRELL P W,et al. Tailoring of stress development in MEMS packaging systems[C]// Materials Research Society Symposium Proceedings. Materials Research Society, 2003(741):139-144.
WALWADKAR S S,CHO J,FARRELL P W,et al. Tailoring of stress development in MEMS packaging systems[C]// Materials Research Society Symposium Proceedings. Materials Research Society, 2003(741):139-144.
[4] PENG P,ZHOU W,YU H,et al. Investigation of the thermal drift of MEMS capacitive accelerometers induced by the overflow of die attachment adhesive[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2017, 6(5):822-830.
PENG P,ZHOU W,YU H,et al. Investigation of the thermal drift of MEMS capacitive accelerometers induced by the overflow of die attachment adhesive[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2017, 6(5):822-830.
[5] YADAV I,DUTTA S,KATIYAR A,et al. Evolution of residual stress in benzocyclobutene films with temperature[J]. Materials Letters, 2015(158):343-346.
YADAV I,DUTTA S,KATIYAR A,et al. Evolution of residual stress in benzocyclobutene films with temperature[J]. Materials Letters, 2015(158):343-346.
[7] XIN Z,PARK S,JUDY M W. Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations[J]. Journal of Microelectromechanical Systems, 2007,16(3):639-649.
XIN Z,PARK S,JUDY M W. Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations[J]. Journal of Microelectromechanical Systems, 2007,16(3):639-649.
[8] GRIESELER R,KLAUS J,STUBENRAUCH M,et al. Residual stress measurements and mechanical properties of AlN thin films as ultra-sensitive materials for nanoelectromechanical systems[J]. Philosophical Magazine, 2012,92(25-27):3392-3401.
GRIESELER R,KLAUS J,STUBENRAUCH M,et al. Residual stress measurements and mechanical properties of AlN thin films as ultra-sensitive materials for nanoelectromechanical systems[J]. Philosophical Magazine, 2012,92(25-27):3392-3401.
[9] PABST O,SCHIFFER M,OBERMEIER E,et al. Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications[J]. Microsystem Technologies, 2012,18(7-8):945-953.
PABST O,SCHIFFER M,OBERMEIER E,et al. Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications[J]. Microsystem Technologies, 2012,18(7-8):945-953.
[10] KILINC Y,UNAL U,ALACA B E. Residual stress gradients in electroplated nickel thin films[J]. Microelectronic Engineering, 2015(134):60-67.
KILINC Y,UNAL U,ALACA B E. Residual stress gradients in electroplated nickel thin films[J]. Microelectronic Engineering, 2015(134):60-67.
[11] TAMURA N,CELESTRE R S,MACDOWELL A A,et al. Submicron X-ray diffraction and its applications to problems in materials and environmental science[J]. Review of Scientific Instruments, 2002,73(3):1369-1372.
TAMURA N,CELESTRE R S,MACDOWELL A A,et al. Submicron X-ray diffraction and its applications to problems in materials and environmental science[J]. Review of Scientific Instruments, 2002,73(3):1369-1372.
[12] BANDI T,DOMMANN A,NEELS A. Analysis of stress in silicon-based microsystems by X-ray diffraction techniques[C]// Microelectronics Packaging Conference. Grenoble,France:IEEE, 2014.
BANDI T,DOMMANN A,NEELS A. Analysis of stress in silicon-based microsystems by X-ray diffraction techniques[C]// Microelectronics Packaging Conference. Grenoble,France:IEEE, 2014.
[13] LIEBOLD C,MüLLER W H. Strain maps on statically bend (001) silicon microbeams using AFM-integrated Raman spectroscopy[J]. Archive of Applied Mechanics, 2015,85(9-10):1353-1362.
LIEBOLD C,MüLLER W H. Strain maps on statically bend (001) silicon microbeams using AFM-integrated Raman spectroscopy[J]. Archive of Applied Mechanics, 2015,85(9-10):1353-1362.
[14] STARMAN L A,JR R A C. Using micro-Raman spectroscopy to assess MEMS Si/SiO2 membranes exhibiting negative spring constant behavior[J]. Experimental Mechanics, 2013,53(4):593-604.
STARMAN L A,JR R A C. Using micro-Raman spectroscopy to assess MEMS Si/SiO2 membranes exhibiting negative spring constant behavior[J]. Experimental Mechanics, 2013,53(4):593-604.
[15] PILUSO N,ANZALONE R,CAMARDA M,et al. Micro-Raman analysis and finite element modeling of 3 C‐SiC microstructures[J]. Journal of Raman Spectroscopy, 2013,44(2):299-306.
PILUSO N,ANZALONE R,CAMARDA M,et al. Micro-Raman analysis and finite element modeling of 3 C‐SiC microstructures[J]. Journal of Raman Spectroscopy, 2013,44(2):299-306.
[16] DUTTA S,SAXENA G,SHAVETA,et al. Comparison of residual stress in deep boron diffused silicon (100), (110) and (111) wafers[J]. Materials Letters, 2013(100):44-46.
DUTTA S,SAXENA G,SHAVETA,et al. Comparison of residual stress in deep boron diffused silicon (100), (110) and (111) wafers[J]. Materials Letters, 2013(100):44-46.
[17] MIYATAKE T,PEZZOTTI G. Tensor-resolved stress analysis in silicon MEMS device by polarized Raman spectroscopy[J]. Physica Status Solidi (a), 2011,208(5):1151-1158.
MIYATAKE T,PEZZOTTI G. Tensor-resolved stress analysis in silicon MEMS device by polarized Raman spectroscopy[J]. Physica Status Solidi (a), 2011,208(5):1151-1158.
[18] STARMAN L A,LOTT J A,AMER M S,et al. Stress characterization of MEMS microbridges by micro-Raman spectroscopy[J]. Sensors and Actuators A: Physical, 2003,104(2):107-116.
STARMAN L A,LOTT J A,AMER M S,et al. Stress characterization of MEMS microbridges by micro-Raman spectroscopy[J]. Sensors and Actuators A: Physical, 2003,104(2):107-116.
[19] ZHAO C,LI M,YIN M,et al. Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators[C]// IEEE International Conference on Nano/micro Engineered & Molecular Systems. Suzhou,China:IEEE, 2013.
ZHAO C,LI M,YIN M,et al. Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators[C]// IEEE International Conference on Nano/micro Engineered & Molecular Systems. Suzhou,China:IEEE, 2013.
[20] VAN DRIE.NHUIZEN B P,GOOSEN J F L,FRENCH P J,et al. Comparison of techniques for measuring both compressive and tensile stress in thin films[J]. Sensors & Actuators A: Physical, 1993(37–38):756-765.
VAN DRIE.NHUIZEN B P,GOOSEN J F L,FRENCH P J,et al. Comparison of techniques for measuring both compressive and tensile stress in thin films[J]. Sensors & Actuators A: Physical, 1993(37–38):756-765.
[21] ANZALONE R,D'ARRIGO G,CAMARDA M,et al. Advanced residual stress analysis and FEM simulation on heteroepitaxial 3CSiC for MEMS application[J]. Journal of Microelectromechanical Systems, 2011,20(3):745-752.
ANZALONE R,D'ARRIGO G,CAMARDA M,et al. Advanced residual stress analysis and FEM simulation on heteroepitaxial 3CSiC for MEMS application[J]. Journal of Microelectromechanical Systems, 2011,20(3):745-752.
[22] ERICSON F,GREEK S,S.DERKVIST J,et al. High-sensitivity surface micromachined structures for internal stress and stress gradient evaluation[J]. Journal of Micromechanics and Microengineering, 1997,7(1):30-36.
ERICSON F,GREEK S,S.DERKVIST J,et al. High-sensitivity surface micromachined structures for internal stress and stress gradient evaluation[J]. Journal of Micromechanics and Microengineering, 1997,7(1):30-36.
[23] LIN L,PISANO A P,HOWE R T. A micro strain gauge with mechanical amplifier[J]. Journal of Microelectromechanical Systems, 1997,6(4):313-321.
LIN L,PISANO A P,HOWE R T. A micro strain gauge with mechanical amplifier[J]. Journal of Microelectromechanical Systems, 1997,6(4):313-321.
[24] HE Q,LUO Z X,CHEN X Y. Comparison of residual stress measurement in thin films using surface micromachining method[J]. Thin Solid Films, 2008,516(16):5318-5323.
HE Q,LUO Z X,CHEN X Y. Comparison of residual stress measurement in thin films using surface micromachining method[J]. Thin Solid Films, 2008,516(16):5318-5323.