LIUMeng, HUANG Qinghua, XU Wei, TANG Bin. A novel measurement method of ultra-low residual stress in MEMS package[J]. Journal of Terahertz Science and Electronic Information Technology , 2020, 18(3): 531

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Journals >Journal of Terahertz Science and Electronic Information Technology >Volume 18 >Issue 3 >Page 531 > Article
- Journal of Terahertz Science and Electronic Information Technology
- Vol. 18, Issue 3, 531 (2020)
Abstract

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