• Journal of Infrared and Millimeter Waves
  • Vol. 27, Issue 2, 91 (2008)
[in Chinese]1、2, [in Chinese]1, [in Chinese]1、2, [in Chinese]2、3, [in Chinese]1、2, [in Chinese]1、2, and [in Chinese]1、3
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. APPLICATION OF ELECTROLESS Ni PLATING IN INFRARED FPA FABRICATION[J]. Journal of Infrared and Millimeter Waves, 2008, 27(2): 91 Copy Citation Text show less
    References

    [1] Wood R A.High-performance infrared thermal imaging with monolithic silicon focal planes operating at room temperature[J].IEEE on IEDM,1993,175-177.

    [2] Herring R J,Howard P E.Design and performance of the ULTRA 320×240 uncooled focal plane array and sensor[J].Proc.SPIE,1996,2746:2-12.

    [3] Murphy D F,Ray M,Wyles R,et al.High-sensitivity (25-um pitch) microbolometer FPAs and application development[J].Proc.SPIE,2001,4369:222-229.

    [4] Hay KA,Van Deusen D.Uncooled focal plane array detector development at infrared vision technology corporation[J].Proc.SPIE,2005,5783:514-525.

    [8] Hutt D A,Liu C Q,Conway P P,et al.Electroless nickel bumping of aluminum bondpads[J].IEEE Trans.on components and Packaging Technology,2002,25:98-105.

    [9] Simon J,Zakel E,Reichl H.Electroless deposition of bumps for TAB technology[J].Metal Finish,1990,88:23-26.

    [10] Aschenbrenner R,Ostmann A,Beutler U,et al.Electroless nickel/copper plating as a new bump metallization[J].IEEE Trans.Comp.,Package.Manufact.Technol.B,1995,18:334-338.

    [11] Qi G,Chen X,Shao Z.Influence of bath chemistry on Zincate morphology on aluminum bond pad[J].Thin Solid Film,2002,406:204-209.

    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. APPLICATION OF ELECTROLESS Ni PLATING IN INFRARED FPA FABRICATION[J]. Journal of Infrared and Millimeter Waves, 2008, 27(2): 91
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