• Chinese Optics Letters
  • Vol. 8, Issue 10, 1000 (2010)
Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, and Liang Zhang
Author Affiliations
  • Department of Applied Physics, Nanjing University of Science &
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    DOI: 10.3788/COL20100810.1000 Cite this Article Set citation alerts
    Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang. Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser[J]. Chinese Optics Letters, 2010, 8(10): 1000 Copy Citation Text show less
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    CLP Journals

    [1] Jia Li, Liming Dong, Chenyin Ni, Zhonghua Shen, Hongchao Zhang. Application of ultrasonic surface waves in the detection of microcracks using the scanning heating laser source technique[J]. Chinese Optics Letters, 2012, 10(11): 111403

    Data from CrossRef

    [1] Sungho Choi, Kyung-Young Jhang. Numerical study on thermal stress cutting of silicon wafers using two-line laser beams. Journal of Mechanical Science and Technology, 33, 3621(2019).

    [2] Chun Yang Zhao, Hong Zhi Zhang, Li Jun Yang, Yang Wang. Curve Cutting ZrO2 Ceramic and Cooling Lower Surface Cutting Silicon Wafer with Laser Induced Thermal-Crack Propagation. Applied Mechanics and Materials, 711, 222(2014).

    [3] C.Y. Zhao, Hong Zhi Zhang, Y. Wang. Research on Laser Induced Thermal-Crack Propagation Cutting Silicon Wafer. Advanced Materials Research, 628, 211(2012).

    [4] P. Romero, N. Otero, I. Coto, C. Leira, A. González. Experimental Study of Diode Laser Cutting of Silicon by Means of Water Assisted Thermally Driven Separation Mechanism. Physics Procedia, 41, 617(2013).

    [5] R. M. Akhmadullin, S. V. Gagarskiy, A. N. Sergeev. Laser induced damage threshold of high reflective dielectric coatings on absorbing substrate. 2018 International Conference Laser Optics (ICLO), 117(2018).

    [6] Sungho Choi, Kyung-Young Jhang. Thermal damages on the surface of a silicon wafer induced by a near-infrared laser. Optical Engineering, 53, 017103(2014).

    [7] Di Dai, Yugang Zhao, Chen Cao, Ruichun Dong, Haiyun Zhang, Qian Liu, Zhuang Song, Xiajunyu Zhang, Zhilong Zheng, Chuang Zhao. Experimental Investigation on Process Parameters during Laser-Assisted Turning of SiC Ceramics Based on Orthogonal Method and Response Surface Methodology. Materials, 15, 4889(2022).

    Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang. Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser[J]. Chinese Optics Letters, 2010, 8(10): 1000
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