Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

Jian Liu; Jian Lu; Xiaowu Ni; Gang Dai; Liang Zhang

doi:10.3788/COL20100810.1000

Journals >Chinese Optics Letters >Volume 8 >Issue 10 >Page 1000 > Article

Chinese Optics Letters
Vol. 8, Issue 10, 1000 (2010)

Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, and Liang Zhang

Author Affiliations

Department of Applied Physics, Nanjing University of Science &

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DOI: 10.3788/COL20100810.1000 Cite this Article Set citation alerts

Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang. Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser[J]. Chinese Optics Letters, 2010, 8(10): 1000 Copy Citation Text

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Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang. Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser[J]. Chinese Optics Letters, 2010, 8(10): 1000

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