To improve the interface, shorten the process, and reduce copper consumption as well as production input, we use selective laser sintering technology to rapidly prepare molded parts of porous graphite. The effects of graphite preformation states, electroplating process parameters, and plating time on the deposition rate, the apparent morphology and bonding conditions of the plating and substrate are studied. The results reveal that for the preformed graphite that is not impregnated with phenolic resin, the bonding strength between the plating and the substrate does not meet the application requirements. After the preformed graphite is immersed in phenolic resin for 2-3 times under a vacuum pressure, the plating deposition rate is best, and the bonding force between the plating and the substrate meets the application requirements. When the electroplating time is 30 min to 50 min, the deposition rate is best, and a complete, continuous, and glossy plating on the surface can be obtained. When the current density is 5×10 2-6.25×10 2 A·m -2, the plated grains are uniform and dense, and a better plating can be obtained.