The visible micro-imaging technology cannot observe the chip internal structure. In order to sovle this issue, a silicon-based semiconductor chip laser infrared microscopy imaging system was designed. The characteristic of 1 064 nm wavelength of infrared laser that has a certain penetration depth for silicon material was applied for the design. A microscope objective with numerical aperture of 0.42 was adopted in this system. The multimode silica fiber vibration method was used to eliminate the speckle noise. The track pitch of CD-RW disk image was observed by microscope infrared imaging. The results showed that the system resolution can reach 1.6 μm and close to the theoretical value. So it can achieve internal structure observation of static RAM of which the thickness of the chip is 70 μm.