• Microelectronics
  • Vol. 53, Issue 5, 930 (2023)
LI Jinlong, JIANG Kai, ZHU Hongjiao, and QIU Sheng
Author Affiliations
  • [in Chinese]
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    DOI: 10.13911/j.cnki.1004-3365.230085 Cite this Article
    LI Jinlong, JIANG Kai, ZHU Hongjiao, QIU Sheng. Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell[J]. Microelectronics, 2023, 53(5): 930 Copy Citation Text show less
    References

    [1] YAN L C, YAO J W, DAI Y, et al. Study of thermal stress fluctuations at the die-attach solder interface using the finite element method [J]. Electronics, 2021, 11(1): 62-66.

    [2] HUANG Y L, DENG H F, LUO Y F, et al. Fatigue mechanism of die-attach joints in IGBTs under low-amplitude temperature swings based on 3D electro-thermal-mechanical FE simulations [J]. IEEE Transactions on Industrial Electronics, 2021, 68(4): 3033-3043.

    [3] THANG T S, SUN D C, KOAY H K. Characterization of Au-Sn eutectic die attach process for optoelectronics device [C]// 2005 International Symposium on Electronics Materials and Packaging. Tokyo, Japan. 2005: 438-445.

    [4] HEGDE S, PRABHU K N. Modification of eutectic silicon in Al-Si alloys [J]. Journal of Materials Science, 2008, 43(9): 3009-3027.

    [5] ZHANG H W, MINTER J, LEE N C. A brief review on high-temperature, Pb-free die-attach materials [J]. Journal of Electronic Materials, 2019, 48: 201-210.

    [6] HUANG Y F, LIU W S, MA Y Z, et al. Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder [J]. Journal of Materials Science: Materials in Electronics, 2018, 29: 436-445.

    [7] GAO H, LI Y Z. Thermal stress analysis of high temperature autoclave by ANSYS [J]. Advanced Materials Research, 2013, 721: 644-647.

    [8] PATIL S P, WAGHMARE G. Determination of thermal induced stresses in semiconductor chip package by using finite element analysis: a brief review [J]. International Journal of Engineering Research & Technology, 2015, 4(4): 44-47.

    [9] BOLEY B A, WEINER J H, PRAGER W. Theory of thermal stresses [J]. Journal of Applied Mechanics, 1961, 28(2): 318-335.

    [10] ROSENFIELD A R, AVERBACH B L. Effect of stress on the expansion coefficient [J]. Journal of Applied Physics, 1956, 27: 154-164.

    LI Jinlong, JIANG Kai, ZHU Hongjiao, QIU Sheng. Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell[J]. Microelectronics, 2023, 53(5): 930
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