Design and Optimization of Internal Fin Structure of Multi-Tube Laser Microchannel

Rui Zhao; Linlin Shi; Yue Wang; Yan Li; Yonggang Zou; Xiaohui Ma

doi:10.3788/LOP222711

[1] Ma X Y, Zhang N L, Zhong L et al. Research progress of high power semiconductor laser pump source[J]. High Power Laser and Particle Beams, 32, 121010(2020).

[2] Li M Y, He J. Development situations of high power semiconductor laser for military applications in advanced countries[J]. Semiconductor Technology, 40, 321-327(2015).

[3] Wang J J, Shi L L, Ma X H et al. Thermal analysis and fiber coupling simulation design of multi-single emitters stacked semiconductor laser[J]. Chinese Journal of Luminescence, 42, 104-110(2021).

[4] Gao S X, Wu D Y, Lü W Q et al. High density packaging diode laser[J]. High Power Laser and Particle Beams, 20, 1426-1430(2008).

[5] Hou D, Wang J W, Zhang P et al. High power diode laser stack development using gold-tin bonding technology[J]. Proceedings of SPIE, 9346, 934604(2015).

[6] Jing H Q, Zhong L, Ni Y Q et al. Thermal Analysis of Laminated Heat Dissipation Structure of High Power Density Laser Diode[J]. Acta Luminescen Sinica, 37, 81-87(2016).

[7] Li B, Wang Z F, Qiu B C et al. High temperature characteristic mechanism of high-power semiconductor laser array[J]. Acta Luminescen Sinica, 41, 1158-1164(2020).

[8] Zhang D Y, Xie Y K, Li C Y et al. Simulation and optimization of high power semicondutor laser microchannel heat sink[J]. Chinese Journal of Lasers, 44, 0202008(2017).

[9] Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI[J]. IEEE Electron Device Letters, 2, 126-129(1981).

[10] Tan H, Wu L W, Wang M Y et al. Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling[J]. International Journal of Heat and Mass Transfer, 129, 681-689(2019).

[11] Qu X J, Xie Z H, Guan X N et al. Constructal design of rectangular heat sink with leaf-like microchannel under uniform heat source[J]. Semiconductor Optoelectronics, 42, 525-531(2021).

[12] Derakhshanpour K, Kamali R, Eslami M et al. Improving performance of single and double-layered microchannel heat sinks by cylindrical ribs: a numerical investigation of geometric parameters[J]. International Communications in Heat and Mass Transfer, 126, 105440(2021).

[13] Lee Y J, Singh P K, Lee P S. Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study[J]. International Journal of Heat and Mass Transfer, 81, 325-336(2015).

[14] Jiang G S, Diao L Y, Kuang K. Understanding of laser, laser diodes, laser diode packaging and its relationship to tungsten copper[M]. Advanced thermal management materials, 123-140(2012).

[15] Bai G Z, Zhang Y J, Liu X Y et al. High-temperature thermal conductivity and thermal cycling behavior of Cu-B/diamond composites[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10, 626-636(2020).

[16] Shen L M, Ji J J, Luo F et al. Flow and heat transfer characteristics of micro-channel cooling chip at non-uniform heat flux[J]. Journal of Central South University (Science and Technology), 52, 1809-1816(2021).