• Photonic Sensors
  • Vol. 13, Issue 2, 230232 (2023)
Yuxuan CHEN1, Yuke LI1, Zhengda HU1, Zexiang WANG1, Zhenxing LI1, and Jicheng WANG1、2、*
Author Affiliations
  • 1School of Science, Jiangsu Provincial Research Center of Light Industrial Optoelectronic Engineering and Technology, Jiangnan University, Wuxi 214122, China
  • 2State Key Laboratory of Millimeter Waves, Southeast University, Nanjing 210096, China
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    DOI: 10.1007/s13320-022-0673-6 Cite this Article
    Yuxuan CHEN, Yuke LI, Zhengda HU, Zexiang WANG, Zhenxing LI, Jicheng WANG. High-Performance Quality Factor Based Sensor With Diagonal Cylinder Metasurface of the Bound State in the Continuum[J]. Photonic Sensors, 2023, 13(2): 230232 Copy Citation Text show less

    Abstract

    High-quality-factor (high-Q-factor) electromagnetic resonance plays an important role in sensor applications. Previously proposed gas refractive index sensors are often limited by the large cavity length or microscale fabrication process in practical applications. Recently, ultra-high Q factor resonance based on the bound state in the continuum (BIC) has provided a feasible approach to solve these problems. In this paper, we propose a metasurface structure consisting of a single size tetramer cylinder. It supports dual band toroidal dipole (TD) resonances driven by BIC. The physical mechanism of double TD resonances is clarified by the multipole decomposition of the metasurface band structure and far-field scattering power. The sensor structure based on this achieves a sensitivity of 518.3 MHz/RIU, and the maximum line width does not exceed 680 kHz. The high-Q-factor electromagnetic resonance has the advantages of polarization independence and simplicity to manufacture. These findings will open up an avenue to develop the ultrasensitive sensor in the gigahertz regime.
    Yuxuan CHEN, Yuke LI, Zhengda HU, Zexiang WANG, Zhenxing LI, Jicheng WANG. High-Performance Quality Factor Based Sensor With Diagonal Cylinder Metasurface of the Bound State in the Continuum[J]. Photonic Sensors, 2023, 13(2): 230232
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