The research on photolithography technology and photoresist materials is crucial, acting as a foundation for the advancement of modern microelectronics, semiconductor manufacturing, and various high-tech industries. Photolithography, a process that transfers complex circuit designs onto silicon wafers or other substrates with high precision and resolution, has significantly enhanced the integration density and performance of integrated circuits (ICs). This technology has drastically reduced manufacturing costs and enabled the rapid development of information technology. With the escalating demand for high-performance chips, driven by the proliferation of the internet of things (IoT), artificial intelligence (AI), and quantum computing, advanced photolithography techniques are becoming crucial. For instance, IoT devices require low-power, high-integration sensors, and processors, whereas AI applications demand powerful computational capabilities and high-speed data transmission. The continuous breakthrough of the resolution limits in photolithography enables the fabrication of sophisticated chips, thereby supporting the evolution of these cutting-edge technologies. Moreover, the adaptability and accuracy of photolithography extend beyond semiconductor manufacturing, with extensive applications in microelectromechanical systems (MEMS), photonics, and biomedicine. In MEMS, photolithography facilitates the fabrication of intricate mechanical structures at a microscopic scale, which are essential for sensors, actuators, and miniaturized devices. In photonics, it is used to fabricate optical components and devices, such as waveguides and photonic crystals, which are crucial for optical communication and sensing. In biomedicine, photolithography is essential in developing microfluidic devices, biochips, and tissue engineering scaffolds, contributing to advancements in diagnostics, drug delivery, and regenerative medicine. The broad applicability and accuracy of photolithography render it an indispensable tool for innovation across these diverse fields.

The development of novel photoresist materials is a key factor in the progress of photolithography, addressing the growing demands for higher resolution, sensitivity, and process compatibility. Traditional photoresists, such as positive and negative resists, have been extensively used for their reliability and ease of use. However, the increasing complexity and miniaturization of devices necessitate the exploration of specialized photoresists. These new materials, such as those used in nanoimprint lithography (NIL), laser direct writing (LDW), and scanning probe lithography, offer unique properties that enhance the performance of photolithographic processes. For example, NIL photoresists facilitate cost-effective and high-resolution pattern transfer, making them ideal for large-scale production. LDW photoresists provide unparalleled spatial resolution and flexibility, making them suitable for creating complex and precise structures. Continuous innovation in photoresist chemistry is essential for advancing photolithography and meeting the stringent requirements of next-generation devices. Furthermore, environmental sustainability is a growing concern in the semiconductor industry, and the development of eco-friendly photoresists is a crucial step toward mitigating the environmental impact of photolithography. Water- and bio-based photoresists signify important breakthroughs, providing biodegradability and reduced reliance on hazardous chemicals. These environmentally friendly alternatives enhance sustainable manufacturing practices and align with global initiatives to mitigate climate change and promote green technologies. By addressing existing challenges and exploring new frontiers, this research paves the way for more efficient, precise, and sustainable photolithographic processes, thereby advancing technological progress and environmental sustainability.

Photolithography and photoresist materials have witnessed significant advancements over the past few decades, driven by the relentless pursuit of higher resolution, increased efficiency, and broader application domains. The most significant development is the transition from conventional deep ultraviolet (UV) lithography (DUVL) to extreme UV lithography (EUVL). The EUVL, which uses a 13.5 nm wavelength, has revolutionized the semiconductor industry by facilitating the fabrication of features at 7 nm node and smaller. The introduction of the first commercial EUVL system by ASML in 2019 marked a significant milestone, as it significantly improved the resolution and production efficiency, making it possible to manufacture 5 nm and even smaller nodes (Fig. 5). This advancement has been crucial for the development of high-performance chips required by emerging technologies such as AI, the IoT, and quantum computing. The success of EUVL has prompted further research into optimizing EUV light sources, such as the development of new types of discharge-produced plasma sources based on liquid tin jet electrodes and the study of the temporal evolution parameters of the laser-produced tin plasma.

Another significant advancement is the development of advanced photoresist materials tailored for high-resolution and high-sensitivity applications. Traditional photoresists have been the backbone of photolithography for many years. However, the increasing demands for finer feature sizes and better process control have prompted the investigation of novel photoresist formulations. For example, chemically amplified photoresists (CAPR) have become prevalent in EUVL, where the resist sensitivity and resolution are significantly enhanced through acid-catalyzed reactions. Furthermore, the development of multi-photon polymerization (MPP) photoresists has opened up new possibilities for three-dimensional (3D) and high-resolution patterning. MPP facilitates the fabrication of complex structures with sub-micron resolution, making it highly suitable for applications in MEMS and biomedicine. The integration of nanocomposites into photoresists has also been explored to improve their mechanical properties and functionality, such as the development of transparent magnesium aluminate spinel ceramics for additive manufacturing. These advancements in photoresist materials are crucial for pushing the boundaries of photolithography and facilitating the fabrication of more sophisticated and multifunctional devices.

Research on photolithography technology and photoresist materials has significantly advanced, driving the development of modern microelectronics and semiconductor manufacturing. The transition from conventional DUVL to EUVL has facilitated the fabrication of features at the 7 nm node and smaller, markedly improving the performance and integration density of the ICs. The development of advanced photoresist materials, such as CAPR and MPP photoresists, has further pushed the boundaries of resolution and functionality, creating new opportunities for applications in MEMS, photonics, and biomedicine. Moreover, the integration of electron beam lithography with other nanofabrication techniques has improved the accuracy and adaptability of nanostructure fabrication, supporting the development of high-density, high-performance devices.

The future of photolithography depends on interdisciplinary collaboration, intelligent automation, and multifunctional integration. Interdisciplinary efforts in materials science, chemistry, physics, and computer science will persist in advancing innovations in photoresist chemistry and lithography processes. The adoption of machine learning algorithms for real-time optimization and control of lithography parameters will improve process consistency and efficiency, thereby reducing production costs and waste. Moreover, the development of multifunctional photoresists with properties such as conductivity, magnetism, and biological activity will expand the applicability of photolithography, facilitating the creation of advanced devices for flexible electronics, data storage, and biomedical imaging. With the increasing demand for high-performance and sustainable technologies, the ongoing advancement of photolithography will be pivotal in influencing the future of microelectronics and other fields.