According to the requirement of miniaturization, a digital optical transceiver microsystem was designed. Based on system-in-package technology, the integrated ceramic pin grid array package with tube shell and substrate was used to integrate all kinds of components such as bare chips, optical devices and resistance capacitances required by optical transceiver system. Through layout design, signal integrity, power integrity and thermal stress simulation, the sample was developed. After testing, the signal receiving SNR was greater than 65 dBFs, and SFDR was greater than 86 dBc. The module function was stable, and the specification was reliable, which met the actual needs.