High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology

Jing Liu; Mingjin Wang; Yufei Wang; Xuyan Zhou; Ting Fu; Aiyi Qi; Hongwei Qu; Xiaoxu Xing; Wanhua Zheng

doi:10.3788/COL202220.071403

Journals >Chinese Optics Letters >Volume 20 >Issue 7 >Page 071403 > Article

Chinese Optics Letters
Vol. 20, Issue 7, 071403 (2022)

High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology | Editors' Pick

Jing Liu^1,2,*, Mingjin Wang¹, Yufei Wang^1,2,3,4, Xuyan Zhou¹..., Ting Fu^1,2, Aiyi Qi^1,3, Hongwei Qu^1,2,3,4, Xiaoxu Xing^1,2 and Wanhua Zheng^1,2,3,4,5,**|Show fewer author(s)

Author Affiliations

¹Laboratory of Solid-State Optoelectronics Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

²Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

³State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

⁴College of Future Technology, University of Chinese Academy of Sciences, Beijing 101408, China

⁵School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

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DOI: 10.3788/COL202220.071403 Cite this Article Set citation alerts

Jing Liu, Mingjin Wang, Yufei Wang, Xuyan Zhou, Ting Fu, Aiyi Qi, Hongwei Qu, Xiaoxu Xing, Wanhua Zheng, "High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology," Chin. Opt. Lett. 20, 071403 (2022) Copy Citation Text

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