• Infrared and Laser Engineering
  • Vol. 34, Issue 5, 505 (2005)
[in Chinese], [in Chinese], [in Chinese], and [in Chinese]
Author Affiliations
  • [in Chinese]
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    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Design of novel absorptive thin film for laser welding in optoelectronic device capsulation[J]. Infrared and Laser Engineering, 2005, 34(5): 505 Copy Citation Text show less

    Abstract

    A kind of absorptive thin film was designed and used in laser welding of SiO2, Si and LiNbO3. This absorptive thin film of three layer metal-dielectric-metal structure is designed for further reducing the high reflectance of the Nd:YAG laser beam on the surface of the thin layer that is utilized as solder between the transparent parent materials. The actual absorption of laser energy in experiment exceeds 99%. This combination of absorber and solder transformed the laser energy into heat efficiently and decreased the minimum necessary incident laser power transmitting through the transparent parent materials. As a result, the damage of the parent materials, which is suffered from laser transmission, was avoided; On the other hand, mechanical stability of the welded materials had been improved. Experiment shows the difference between welding with and without the absorptive thin film.[
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Design of novel absorptive thin film for laser welding in optoelectronic device capsulation[J]. Infrared and Laser Engineering, 2005, 34(5): 505
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