• Journal of Semiconductors
  • Vol. 44, Issue 9, 091604 (2023)
Memoona Qammar*, Bosen Zou*, and Jonathan E. Halpert*
Author Affiliations
  • Department of Chemistry, Hong Kong University of Science and Technology (HKUST), Clear Water Bay Road, Kowloon 999077, Hong Kong SAR, China
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    DOI: 10.1088/1674-4926/44/9/091604 Cite this Article
    Memoona Qammar, Bosen Zou, Jonathan E. Halpert. Organic-inorganic halide perovskites for memristors[J]. Journal of Semiconductors, 2023, 44(9): 091604 Copy Citation Text show less
    (Color online) (a) The basic four elements of an electrical circuit. Reproduced with permission from Ref. [3]. Copyright 2008, Nature publisher. (b) MIM structure of a memristor. (c) ABX3 structure of perovskite (A and B: cations and X: anion). Reproduced with permission from Ref. [18]. Copyright 2014, Nature publisher.
    Fig. 1. (Color online) (a) The basic four elements of an electrical circuit. Reproduced with permission from Ref. [3]. Copyright 2008, Nature publisher. (b) MIM structure of a memristor. (c) ABX3 structure of perovskite (A and B: cations and X: anion). Reproduced with permission from Ref. [18]. Copyright 2014, Nature publisher.
    (Color online) Different switching mechanisms in OHP memristors. (a) Iodide vacancies are arbitrarily distributed. (b) Iodide vacancies aligned under influence of applied voltage. Inset: Movement of vacancies along the octahedral edge of structure. Reproduced with permission from Ref. [23]. Copyright 2016, American Chemical Society. (c) Architecture of Ag/MAPbI3/Ag device. (d) SEM micrograph showing 1−4 positions for EDS analysis. (e) EDS spectrum of device at LRS showing Pb and I peak intensities at four different positions shown in SEM image. Reproduced with permission from Ref. [24]. Copyright 2017, WILEY. Steps of RS via double-filament model in the Ag/MAPbI3/FTO memory device. (f) The initial state (HRS), (g) forming, (h) SET (LRS), and (i) RESET process of the device with thick MAPbI3 layer. (j) The initial state, (k) forming, (l) SET, and (m) RESET process of the device with relatively thinner MAPbI3. Reproduced with permission from Ref. [29]. Copyright 2016, American Chemical Society. (n) Mechanism of electrical switching (Ⅰ) initial state corresponding to HRS: hole trapping centres locate at the perovskite surface; (Ⅱ) SET process: Hole trap states are filled, shifting the Fermi level to the valence band; (Ⅲ) remove light electricity: a lowered barrier and quasi ohmic contact are resulted corresponding to LRS; and (Ⅳ) electrical reset: Holes are extracted from the trap states and a transition from LRS to HRS occurs. Reproduced with permission from Ref. [30]. Copyright 2018, WILEY.
    Fig. 2. (Color online) Different switching mechanisms in OHP memristors. (a) Iodide vacancies are arbitrarily distributed. (b) Iodide vacancies aligned under influence of applied voltage. Inset: Movement of vacancies along the octahedral edge of structure. Reproduced with permission from Ref. [23]. Copyright 2016, American Chemical Society. (c) Architecture of Ag/MAPbI3/Ag device. (d) SEM micrograph showing 1−4 positions for EDS analysis. (e) EDS spectrum of device at LRS showing Pb and I peak intensities at four different positions shown in SEM image. Reproduced with permission from Ref. [24]. Copyright 2017, WILEY. Steps of RS via double-filament model in the Ag/MAPbI3/FTO memory device. (f) The initial state (HRS), (g) forming, (h) SET (LRS), and (i) RESET process of the device with thick MAPbI3 layer. (j) The initial state, (k) forming, (l) SET, and (m) RESET process of the device with relatively thinner MAPbI3. Reproduced with permission from Ref. [29]. Copyright 2016, American Chemical Society. (n) Mechanism of electrical switching (Ⅰ) initial state corresponding to HRS: hole trapping centres locate at the perovskite surface; (Ⅱ) SET process: Hole trap states are filled, shifting the Fermi level to the valence band; (Ⅲ) remove light electricity: a lowered barrier and quasi ohmic contact are resulted corresponding to LRS; and (Ⅳ) electrical reset: Holes are extracted from the trap states and a transition from LRS to HRS occurs. Reproduced with permission from Ref. [30]. Copyright 2018, WILEY.
    (Color online) High and low resistance states of MBI ReRAM under influence of 10 ns, (a) 10 V writing pulse, (b) -10 V erasing pulse. Insets show the incident writing and erasing voltage pulse. Reproduced with permission from Ref. [36]. Copyright 2021, Royal Society of Chemistry. (c) Schematic illustration of biological (top) and artificial (bottom) nociceptor. Reproduced with permission from Ref. [49]. Copyright 2023, American Chemical Society. RS trend in EGaIn/MAPbI3/PEDOT: PSS/ITO (d) SET process and (e) RESET process in dark and in presence of different wavelengths: 636, 588, 507, and 445 nm. Insets show the logarithmic scales of the same processes. (f) Power consumption for SET, RESET and total power consumption under the influence of different light signals. Reproduced with permission from Ref. [17]. Copyright 2023, WILEY.
    Fig. 3. (Color online) High and low resistance states of MBI ReRAM under influence of 10 ns, (a) 10 V writing pulse, (b) -10 V erasing pulse. Insets show the incident writing and erasing voltage pulse. Reproduced with permission from Ref. [36]. Copyright 2021, Royal Society of Chemistry. (c) Schematic illustration of biological (top) and artificial (bottom) nociceptor. Reproduced with permission from Ref. [49]. Copyright 2023, American Chemical Society. RS trend in EGaIn/MAPbI3/PEDOT: PSS/ITO (d) SET process and (e) RESET process in dark and in presence of different wavelengths: 636, 588, 507, and 445 nm. Insets show the logarithmic scales of the same processes. (f) Power consumption for SET, RESET and total power consumption under the influence of different light signals. Reproduced with permission from Ref. [17]. Copyright 2023, WILEY.
    (Color online) Material characterization of FAPbBr3. (a) XRD, (b) UV-VIS and PL spectra, (c) SEM micrograph, (d) device design, (e) RS cycles for as fabricated device, and (f) conductive mechanism via measured and fitted curve for SET state.
    Fig. 4. (Color online) Material characterization of FAPbBr3. (a) XRD, (b) UV-VIS and PL spectra, (c) SEM micrograph, (d) device design, (e) RS cycles for as fabricated device, and (f) conductive mechanism via measured and fitted curve for SET state.
    (Color online) (a) Transmission spectra of pristine PMMA film and MAPbBr3 QDs with a complete device shown in inset. (b) RS cycles of MAPbBr3 QDs based memristor. Reproduced with permission from Ref. [42]. Copyright 2017, AIP Publishing. (c) Device architecture of MAPbI3 QWs/NWs on PET substrate with an enlarged view of QW sandwiched between Ag and Au and crystal structure of MAPbI3. Reproduced with permission from Ref. [50]. Copyright 2021, American Chemical Society.
    Fig. 5. (Color online) (a) Transmission spectra of pristine PMMA film and MAPbBr3 QDs with a complete device shown in inset. (b) RS cycles of MAPbBr3 QDs based memristor. Reproduced with permission from Ref. [42]. Copyright 2017, AIP Publishing. (c) Device architecture of MAPbI3 QWs/NWs on PET substrate with an enlarged view of QW sandwiched between Ag and Au and crystal structure of MAPbI3. Reproduced with permission from Ref. [50]. Copyright 2021, American Chemical Society.
    StructureMethod of synthesisStructureON/OFF ratioVon (V)Voff (V)EnduranceRetention (s)MechanismRef
    FTO/MAPbI3-xClx/AuSolution method3D40.8-0.6>103>4 × 104Ag conductive filament[31]
    PET/ITO/MAPbI3/Au3Antisolvent assisted spin coatAntisolvent assisted spin coating 3D500.7-0.5400104Defect migrationDefect migration[23]
    FTO/c-TiO2/MAPbI3-xClx/AlSpin coating3D1.9 × 1091.10−1.65Active metal filament[26]
    FTO/CH3NH3PbI3/WAntisolvent assisted spin coating3D>1003.1-1.1>100Schottky emission and ohmic conduction[32]
    ITO/PEDOT: PSS/CH3NH3PbI3/PCBM/AgAntisolvent assisted spin coating3D1.3 × 1030.13-0.23103Ion migration[33]
    PET/ITO/MASnBr3/AuAntisolvent assisted spin coating3D1000.65 ± 0.15 V−3.1 ± 0.6 V200104Formation and deformation of VBr[34]
    ITO/PEDOT:PSS/MAPbI3/Au2 step spin coating3D200500[35]
    ITO/MA3Bi2I9/CuChemical vapor deposition (CVD)3D1041−6.91.73 × 103>3 × 105Active metal filament[36]
    EGaIn/MAPbI3/PEDOT: PSS/ITOAntisolvent assisted spin coating3D4.3 × 1030.69−0.41104105VI migration[17]
    Si/SiO2/Ti/Pt/BA2MAn-1PbnI3n+1/AgAntisolvent assisted spin coating2D1070.4–1.2−1.2 to −0.42501.08 × 104Ag or VI CF[37]
    Graphene/(PEA)2PbBr4/AuExfoliation2D10+7.6−1.0100103VBr CF[38]
    ITO/BA2PbBr4/AuVapor deposition2D2.4 × 1033−36 0103VBr CF[39]
    Si/SiO2/Ti/Pt/(PEA)2Cs3Pb4I13/AgSpin coating2D1090.40−0.102302 × 103Ag CF[40]
    F40/MAPbBr1.97Cl1.03/AgSpin coatingNanoparticles5000.55−0.52501 × 103Surface defects/grain boundaries generated due to Cl substitution[41]
    PET/ITO/PMMA/41APbBr3 PeQDs: PMMA/PMMA/AgSpin coatingQuantum dots>1031−14 × 103Trap controlled SCLC[42]
    42u/CH3NH3PbI3/PtVapour deposition>1031−1500>105[43]
    Table 1. Summary of device performances of some OHP based memristors.
    Memoona Qammar, Bosen Zou, Jonathan E. Halpert. Organic-inorganic halide perovskites for memristors[J]. Journal of Semiconductors, 2023, 44(9): 091604
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