[1] Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).

[2] D. B Chrisey, Science 289, 879 (2000).

[3] K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

[4] R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

[5] H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

[6] S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

[7] D. Dimos, B. H. King, and P. Yang, in Proceedings of 1999 International Symposium on Advanced Packaging Materials 186 (1999).

[8] J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).

[9] H. L. Li, X. Y. Zeng, and X. Y. Li, Chin. J. Lasers (in Chinese) (to be published).

[10] X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

[11] Q. Zhang and S. F. Jiang, Architectural Door-Window and Metal Building Materials (in Chinese) (10) 24 (2001).