[1] E. Maisonhaute,C. Prado,P. C. White et al.. Surface acoustic cavitation understood via nanosecond electrochemistry. Part III:shear stress in ultrasonic cleaning[J]. Ultrason. Sonochem.,2003,9(6):297-303
[2] Q. Qi,G. J. Brereton. Mechanisms of removal of micron-sized particles by high-frequency ultrasonic waves[J]. IEEE Trans. Ultrason. Ferroelectrics Freq. Contr.,1995,42(4):619-629
[3] S. Shwartzman,A. Mayer,W. Kem. Megasonic partical removal from solid-state wafers[J]. RCA Rev,1985,46(1):81-105
[4] Jin O. Kim,S. Choi,J. Ho Kim. Vibroacoustic characteristics of ultrasonic cleaners[J]. Appl. Acoust.,1999,58(2):211-228
[5] Fang Qiping,Lin Zhongmao. Megasonic cleaning——a new technologyof ultrasonic cleaning[J]. Chemical Cleaning,1998,14(2):31-32