[1] LEI Yong,FAN Guang-han,LIAO Chang-jun,et al. Research on the thermal property of powerful white LEDs [J]. Journal of Optoelectronics·Laser,2006,17(8):945-947.
[2] FANG Hua,LI Yang. Thermal Analyse and Design of High-Power LED [J]. Advanced Display,2007,18(9):67-70.
[3] ZHANG Hai-bing,Lü Yi-jun,LI Kai-hang,et al. Research on voltage temperature coefficient of high power light-emitting diodes [J]. Journal of Optoelectronics·Laser,2008,19(12):1580-1583.
[4] ZHANG Yue-zong,FENG Shi-wei,XIE Xue-song,et al. Study of Thermal Characteristics of Semiconductor Light Emitting Device [J]. Chinese Journal of Semiconductors,2006,27(2):350-353.
[5] ZHUANG Peng. Thermal Resistance Measurement and Structure Identification for High-Power LED [J]. Advanced Display, 2008,19(8):25-29.
[6] EIA/JEDEC Standard JESD51-1. Integrated Circuits Thermal Measurement Method-Electrical Test Method (Single Semiconductor Device) [S]. USA:ELECTRONIC INDUSTRIES ALLIANCE,1995:3-7.
[7] Han-Youl Ryu,Kyoung-Ho Ha,Jung-Hye Chae,et al. Measurement of junction temperature in GaN-based laser diodes using voltage-temperature characteristics [J]. Appl Phys Lett (S0003-6951),2005,87(9):093506-1-093506-3.
[8] XI Yan-gang,GESSMANN Thomas,XI Jing-qun,et al. Junction temperature in ultraviolet Light-emitting diodes [J]. Jpn J Appl Phys Part 1 (S0021-4922),2005,44(10):7260-7266.
[9] Chhajed S,XI Y,Gessmann Th,et al. Junction temperature in light-emitting diodes assessed by different methods [J]. Proc. of SPIE(S0277-786X),2005,5739:16-24.
[10] Gu Y,Narendran N. A non-contact method for determining junction temperature of phosphor- converted white LEDs [J]. Proc. of SPIE(S0277-786X),2004,5187:107-114.
[11] Ishikawa H,Fujiwara T,Fukiwara K,et al. Accelerated aging test of Ga1-xAlxAs DH lasers [J]. Journal of Applied Physics (S0021-8979),1999,50(4):2518-2522.
[12] Yuqin Zong,Yoshi Ohno. New practical method for measurement of high-power LEDs [C]∥ Proc. CIE Expert Symposium on Advances in Photometry and Colorimetry. CIE x033. Turin,Italy,July 7-8,2008:102-106.
[13] CHEN Yuan-deng. LED manufacturing technology and application [M]. Beijing:Electronic Industry Press,2007:107.
[14] YU Bin-hai,WANG Yao-hao. Junction Temperature and Thermal Resistance Restrict the Developing of High power LED [J]. Chinese Journal of Luminescence,2005,26(6):761-766.
[15] ZHANG Wan-lu,LI Wen-yi,CHEN Yu-yang,et al. Measurement of LED Junction Temperature in Working Circuit [J].China Illuminating Engineering Journal,2008,19(4):50.
[16] CPU Thermal Management[EB/OL]. http:∥www.amd.com/epd/processors/6.32bitproc/x18448/18448.pdf.
[17] LI Han-sun. Fundamentals of Circuit analysis [M]. Beijing:Higher Education Press,1983:407