Research on Ultrasonic Detection and Validity Verification of LTCC Filter Micro-Delamination

ZHANG Yuxing; GONG Guohu; HE Zhigang

doi:10.13911/j.cnki.1004-3365.210386

Journals >Microelectronics >Volume 52 >Issue 4 >Page 695 > Article

Microelectronics
Vol. 52, Issue 4, 695 (2022)

Research on Ultrasonic Detection and Validity Verification of LTCC Filter Micro-Delamination

ZHANG Yuxing, GONG Guohu, and HE Zhigang

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[in Chinese]

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DOI: 10.13911/j.cnki.1004-3365.210386 Cite this Article

ZHANG Yuxing, GONG Guohu, HE Zhigang. Research on Ultrasonic Detection and Validity Verification of LTCC Filter Micro-Delamination[J]. Microelectronics, 2022, 52(4): 695 Copy Citation Text

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References

[3] LEVIKARI S,KARKKAINEN T J,ANDERSSON C,et al. Acoustic detection of cracks and delamination in multilayer ceramic capacitors ［J］. IEEE Trans Indus Appl, 2018, 55(2): 1787-1794.

[4] JMJ T D,RADEMAKER C W,HU C L. Residual stresses in multilayer ceramic capacitors: measurement and computation ［J］. J Elec Packag,2003,125(4)：506-511.

[5] NEUBAUER C. Intelligent X-ray inspection for quality control of solder joints ［J］. IEEE Trans Compon Packag & Manufact Technol Part C, 1997, 20(2)： 111-120.

[6] TICK T,JANTUNEN H. An X-ray imaging-based layer alignment and tape deformation inspection system for multilayer ceramic circuit boards ［J］. IEEE Trans Elec Packag Manufact, 2008, 31(2)： 168-173.

[7] ZARASKA K,GAUDYN J,BIENKOWSKI A, et al. X-Ray inspection of LTCC devices: theory and practice ［J］. J Microelec & Elec Packag, 2011, 8(2): 49-57.

ZHANG Yuxing, GONG Guohu, HE Zhigang. Research on Ultrasonic Detection and Validity Verification of LTCC Filter Micro-Delamination[J]. Microelectronics, 2022, 52(4): 695

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