Qiang Jia, Wengan Wang, Zhanwen A, Zhongyang Deng, Bin Feng, Lei Liu. Low-Temperature Bonding of Ag-Pd Nanoalloy and Its Resistance to Electrochemical-Migration[J]. Chinese Journal of Lasers, 2021, 48(8): 0802014
- Chinese Journal of Lasers
- Vol. 48, Issue 8, 0802014 (2021)
Fig. 1. Schematic illustration of nanoalloy preparation and joint cross-section. (a) Pulsed laser deposition of nanoalloy; (b) cross-section of SiC and DBC substrate joint
Fig. 2. As-deposited Ag-10%Pd nanoalloy film. (a) Ag-10%Pd nanoalloy film; (b) high magnification of Ag-10%Pd nanoalloy; (c) element distribution of Ag in nanoalloy; (d) element distribution of Pd in nanoalloy
Fig. 3. Size distribution of Ag-10%Pd nanoalloy particles. (a) Number distribution; (b) volume ratio
Fig. 4. Sintered joint using Ag-10%Pd nanoalloy and elements distribution in the joint (sintering temperature of 300 ℃). (a) Macro morphology of joint; (b) elements distribution by line scanning
Fig. 5. Typical microstructures and element distribution of Ag-10%Pd sintered layer (sintering temperature of 300 ℃). (a) Microstructure of Ag-Pd sintered layer; (b) Ag distribution; (c) Pd distribution
Fig. 6. Effect of sintering temperature on joint shear strength
Fig. 7. Typical fracture surface of nanoalloy sintered joint (sintering temperature of 300 ℃). (a) Macro morphology of fracture surface; (b) high magnification of fracture surface
Fig. 8. Short-circuit current variation with time for Ag-10%Pd nanoalloy and pure Ag
Fig. 9. Electrochemical-migration product. (a) Pure Ag; (b) Ag-10%Pd
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