• Journal of Advanced Dielectrics
  • Vol. 11, Issue 2, 2150009 (2021)
R. Sun1, W. Xu2, and R. B. van Dover1、*
Author Affiliations
  • 1Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA
  • 2Department of Applied and Engineering Physics, Cornell University, Ithaca, NY 14853, USA
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    DOI: 10.1142/S2010135X21500090 Cite this Article
    R. Sun, W. Xu, R. B. van Dover. Dielectric properties of amorphous Bi–Ti–O thin films[J]. Journal of Advanced Dielectrics, 2021, 11(2): 2150009 Copy Citation Text show less

    Abstract

    We report the unexpectedly excellent dielectric properties of amorphous thin films with compositions in the Bi–Ti–O system. Films were deposited by RF magnetron reactive co-sputtering. In the composition range of 0.5 < x < 0.7, amorphous Bi1xTixOy exhibits excellent dielectric properties, with a high dielectric constant, 𝜀r 53, and a dissipation factor as low as tan δ = 0.007. The corresponding maximum breakdown field reaches 1.6 MV/cm, yielding a maximum stored charge per unit area of up to 8 μC/cm2. This work demonstrates the potential of amorphous Bi–Ti–O as a high-performance thin-film dielectric material that is compatible with high-performance integrated circuits.We report the unexpectedly excellent dielectric properties of amorphous thin films with compositions in the Bi–Ti–O system. Films were deposited by RF magnetron reactive co-sputtering. In the composition range of 0.5 < x < 0.7, amorphous Bi1xTixOy exhibits excellent dielectric properties, with a high dielectric constant, 𝜀r 53, and a dissipation factor as low as tan δ = 0.007. The corresponding maximum breakdown field reaches 1.6 MV/cm, yielding a maximum stored charge per unit area of up to 8 μC/cm2. This work demonstrates the potential of amorphous Bi–Ti–O as a high-performance thin-film dielectric material that is compatible with high-performance integrated circuits.
    R. Sun, W. Xu, R. B. van Dover. Dielectric properties of amorphous Bi–Ti–O thin films[J]. Journal of Advanced Dielectrics, 2021, 11(2): 2150009
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