Yanyan Liu, Lü Fei, Meng Xiao, Xuesong Gao, Jun Zhou, Changxing Du. Microstructures and Property of Aluminum Alloy Doped with Copper Powder Fabricated by Selective Laser Melting[J]. Laser & Optoelectronics Progress, 2023, 60(1): 0114012
- Laser & Optoelectronics Progress
- Vol. 60, Issue 1, 0114012 (2023)
Fig. 1. Morphology and particle size distribution of basic aluminum alloy powder. (a) Morphology; (b) size distribution
Fig. 2. Dimension and physical drawing of tensile test sample
Fig. 3. XRD patterns of different samples. (a) 10°-90°; (b) 64°-67°
Fig. 4. Microstructures of different types of samples. (a) C0; (b) C1; (c) C2; (d) C3
Fig. 5. Microstructure analysis of C2 sample. (a) Microstructure; (b) grain orientation
Fig. 6. Al grain size distribution diagram of samples with different mass fractions of Cu powder. (a) C0; (b) C1; (c) C2; (d) C3
Fig. 7. Tensile test results of different types of samples. (a) Stress-strain curves; (b) tensile strength and elongation
Fig. 8. SEM images of fracture surface of C0 and C2 tensile samples. (a) C0; (b) C2
Fig. 9. SEM images of fracture surface of C3 tensile sample
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Table 1. Physical and chemical parameters of copper powder
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Table 2. Composition of commercial Al250C aluminum alloy powder
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