• Acta Optica Sinica
  • Vol. 27, Issue 7, 1205 (2007)
[in Chinese]1、2、*, [in Chinese]1, [in Chinese]1, [in Chinese]1, and [in Chinese]1、2
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  • 1[in Chinese]
  • 2[in Chinese]
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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Novel in-Situ Non-Flatness Measurement Method of Wafer Chuck in Step-and-Scan Lithographic Tool[J]. Acta Optica Sinica, 2007, 27(7): 1205 Copy Citation Text show less
    References

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    [2] K. Simson, H.-U. Scheunemann, H.-L. Huber. Impact of chuck flatness on wafer distortion and stepper overlay[C]. Proc. SPIE, 1993, 1924: 282~292

    [3] T. Fujisawa, S. Inoue, T. Hagiwara et al.. Desirable edge flatness for CD control in photolithography[C]. Proc. SPIE, 2003, 5040: 600~609

    [4] M.-R. Moitreyee, C. H. Tan, Y. K. Tan. Exposure tool chuck flatness study and effects on lithography[C]. Proc. SPIE, 2001,4404: 14~24

    [5] Intaru Fujita, Fumio M. Sakai, Shigeyuki Uzawa. Next-generation scanner to sub-100-nm lithography[C]. Proc. SPIE, 2003,5040: 811~821

    [6] Butler Hans, Boonman Marcus, Emile Joannes et al.. Lithographic apparatus and device manufacturing method with feed-forward focus control[P]. US7113256, 2004.02.18

    [7] Randy Goodall, Frances Alvarez. Characterization of stepper chuck performance[C]. Proc. SPIE, 1993, 1926: 282~292

    [8] Bruno M. La Fontaine, Jan Hauschild, Mircea V. Dusa et al.. Study of the influence of substrate topography on the focusing performance of advanced lithography scanners[C]. Proc. SPIE, 2003, 5040: 570~581

    [9] Adlai H. Smith, Jr. Hunter, O. Robert et al.. Apparatus and process for determination of dynamic scan field curvature[P]. US7126668, 2004.04.28

    [10] Michael L. Nelson, Justin L. Kreuzer, Peter L. Filosi et al.. Method and system for improving focus accuracy in a lithographic system[P]. US6859260, 2001.08

    [11] R. Goodall, J. Kawski. Effects and interactions of wafer shape and stepper chucks on wafer flatness control[C]. Proceedings, IEEE/SEMI, ASMC, 1993. 118~123

    [12] G. Schulz. Absolute flatness testing by an extended rotation method using two angles of rotation[J]. Appl. Opt., 1993, 32(7): 1055~1065

    [13] Dong-June Choi, Chun-Taek Rim, Soohyun Kim. High sensitivity inductive sensing system for position measurement[C]. Proc. IEEE IMTC, 2000. 595~599

    [17] Le He, Xiangzhao Wang, Weijie Shi et al.. Method for measuring the granite surface topography of wafer stage with laser interferometer[C]. Proc. SPIE, 2006, 6150: 512~518

    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Novel in-Situ Non-Flatness Measurement Method of Wafer Chuck in Step-and-Scan Lithographic Tool[J]. Acta Optica Sinica, 2007, 27(7): 1205
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