Infrared Spectrum Analysis of SF6 and SF6 Decomposition

[1] Qiu Y, Kuffei E. IEEE Transactions on Dielectrics and Electrical Insulation, 1999, 6(6): 892.

[2] Beyer C, Jenett H, Klockow D. IEEE Transactions on Dielectrics and Electrical Insulation, 2000, 7(2): 234.

[3] Piemontesi M, Niemeyer L. IEEE International Symposium on Electrical Insulation. 16-19, June, Montreal, Quebec, Canada, 1996, 2: 828.

[5] Chu F Y. IEEE Transactions on Electrical Insulation. 1986, EI-21(5): 693.

[6] Derdouri A. Casanovas J. Grob R. IEEE Transactions on Eletrcical Insulation, 1989, 12: 1147.

[7] Youshi M, Robin-Jouan Ph, Kanzari Z. IEEE Transactions on Dielectrics and Electrical Insulation, 2005, 12(6): 1193.

[8] Heise H M, Kurte R, Fischer P. Anal.Chem., 1997, 358: 793.

[9] Derdouri A, Casanovas J, Hergli R. J. Appl. Phs., 1989, 65: 1852.

[10] Soppart O, Pilzecker P, Baumbach J I. IEEE Transactions on Dielectrics and Electrical Insulation, 2000, 7(2): 229.

[11] Braun J M, Chu F Y. IEEE Transactions on Power Delivery, 1986, 1: 81.

[12] Kurte R, Beyer C, Heise H M. Anal. Bioanal. Chem., 2002, 373: 639.

[13] Kurte R, Heise H M, Klockow D. J. Mol. Struct., 1999, 480: 211.

[14] Ding Weidong, Hayashi Ryota, Ochi Kohei. IEEE Transactions on Dielectrics and Electrical Insulation, 2006, 13(12): 1200.

[15] Clavreul R, Edf-der France. 7th International Conference on Dielectric Materials Measurements & Applications, 1996, 23-26: 176.