• Spectroscopy and Spectral Analysis
  • Vol. 39, Issue 10, 3179 (2019)
YUE Kong1, CHENG Xiu-cai2, JIA Chong3, LIU Wei-qing1, and LU Wei-dong1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    DOI: 10.3964/j.issn.1000-0593(2019)10-3179-05 Cite this Article
    YUE Kong, CHENG Xiu-cai, JIA Chong, LIU Wei-qing, LU Wei-dong. The Influence of Elevated Temperatures on Wood-Adhesive Joints by Fourier Infrared Spectrum Analysis[J]. Spectroscopy and Spectral Analysis, 2019, 39(10): 3179 Copy Citation Text show less
    References

    [2] Hu P, Han X, Li W D. International Journal of Adhesion and Adhesives, 2013, 41: 119.

    [3] Klippel M, Frangi A. Bauphysik, 2012, 34(4): 142.

    [4] Frangi A, Bertocchi M, Clauss S, et al. Wood Science and Technology, 2012, 46(5): 793.

    [5] Klippel M, Clauss S, Frangi A. European Journal of Wood and Wood Products, 2014, 72(4): 535.

    [6] Clauss S, Joscak M, Niemz P. European Journal of Wood and Wood Products, 2011, 69(1): 101.

    [7] Zhou J, Yue K, Lu W D, et al. Journal of Adhesion Science and Technology, 2017, 31(23): 2630.

    [8] Zhou J, Yue K, Lu W D, et al. Cellulose Chemistry and Technology, 2018, 52(3-4): 239.

    [9] ermák P, Dejmal A. Maderas: Ciencia y Tecnologia, 2013, 15(3): 375.

    [10] tefan B, Miroslav G, Evgeny Y R. Cellulose Chemistry and Technology, 2015, 49(9-10): 789.

    YUE Kong, CHENG Xiu-cai, JIA Chong, LIU Wei-qing, LU Wei-dong. The Influence of Elevated Temperatures on Wood-Adhesive Joints by Fourier Infrared Spectrum Analysis[J]. Spectroscopy and Spectral Analysis, 2019, 39(10): 3179
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