• High Power Laser and Particle Beams
  • Vol. 33, Issue 12, 123015 (2021)
Weijie Wang1、2、3, Zhenguo Zhao1、2、3、4, Shaoliang Hu1、2, Hanyu Li1、2、3, and Haijing Zhou1、2、3、*
Author Affiliations
  • 1CAEP Software Center for High Performance Numerical Simulation, Beijing 100088, China
  • 2Institute of Applied Physics and Computational Mathematics, Beijing 100094, China
  • 3Key Laboratory of Science and Technology on Complex Electromagnetic Environment, CAEP, Mianyang 621900, China
  • 4State Key Laboratory of ASIC & System, Fudan University, Shanghai 201203, China
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    DOI: 10.11884/HPLPB202133.210359 Cite this Article
    Weijie Wang, Zhenguo Zhao, Shaoliang Hu, Hanyu Li, Haijing Zhou. High-performance full-wave computational electromagnetic analysis for chip-system under electromagnetic pulse[J]. High Power Laser and Particle Beams, 2021, 33(12): 123015 Copy Citation Text show less
    Software architecture of parallel programming framework JAUMIN
    Fig. 1. Software architecture of parallel programming framework JAUMIN
    Software platform
    Fig. 2. Software platform
    Comparison of calculated results with commercial software of electric field variation of a dielectric box under plane wave
    Fig. 3. Comparison of calculated results with commercial software of electric field variation of a dielectric box under plane wave
    S parameter calculation compared with commercial software
    Fig. 4. S parameter calculation compared with commercial software
    Geometrical illustration of a dipole antenna
    Fig. 5. Geometrical illustration of a dipole antenna
    Schematic illustration of chip-system model
    Fig. 6. Schematic illustration of chip-system model
    Waveform of input pulse
    Fig. 7. Waveform of input pulse
    Coupling effect of computer case and chip at different simulation time
    Fig. 8. Coupling effect of computer case and chip at different simulation time
    Coupling effect of chip without computer case at different simulation time
    Fig. 9. Coupling effect of chip without computer case at different simulation time
    Lumped port distribution of system-in-package
    Fig. 10. Lumped port distribution of system-in-package
    Port voltage of the listed 20 ports in frequency domain
    Fig. 11. Port voltage of the listed 20 ports in frequency domain
    relative permittivityrelative permeabilitybulk conductivitydielectric loss tangent
    Al2_O3_ceramic 9.81.00.00.0
    aluminum113.8×107
    copper1.01.05.8×107
    gallium_arsenide12.91.01.00.0
    gold1.01.04.1×107
    rogers RO4350 (tm)3.661.00.00.004
    silicon11.91.00.00.0
    Table 1. Material properties of Chip
    number of gridsnumber of CPU corescenter frequency/GHztime step/stotal simulation time/s
    10 000 0001201.02.0×10−1110.0×10−8
    Table 2. Parallel computing information
    time/nswith computer box shielding/(V·m−1without computer box shielding/(V·m−1
    0.40.18600.4674
    5.29.01454.68
    1039.36917.8
    Table 3. Maximum value of electric fieldat different time
    Weijie Wang, Zhenguo Zhao, Shaoliang Hu, Hanyu Li, Haijing Zhou. High-performance full-wave computational electromagnetic analysis for chip-system under electromagnetic pulse[J]. High Power Laser and Particle Beams, 2021, 33(12): 123015
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