• Opto-Electronic Engineering
  • Vol. 41, Issue 3, 7 (2014)
FU Jie*, WANG Xiaohua, LI Jinhua, FANG Xuan, and WEI Zhipeng
Author Affiliations
  • [in Chinese]
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    DOI: 10.3969/j.issn.1003-501x.2014.03.002 Cite this Article
    FU Jie, WANG Xiaohua, LI Jinhua, FANG Xuan, WEI Zhipeng. Design and Fabrication of High Aspect-ratio Hard X-ray Zone Plates[J]. Opto-Electronic Engineering, 2014, 41(3): 7 Copy Citation Text show less

    Abstract

    The manufacture of high aspect-ratio hard X-ray zone plates for Inertial Confinement Fusion (ICF) experiment by using electron beam lithography and X-ray lithography was demonstrated. The X-ray lithography mask was first fabricated on hollow polyimide film to reduce the back-scattering during electron-beam lithography process. Then multiple X-ray exposures and full water electroplating method were used to increase the lodging resistance of the resist pattern. The zone plates with outermost zone width of 350 nm, profile thickness of 3.5 μm, and aspect ratio of 10, were successfully fabricated by using the combined technology. The structure of zone plates is steep and has excellent graphics quality, and can be used for 10 to 30 keV X-ray imaging system.
    FU Jie, WANG Xiaohua, LI Jinhua, FANG Xuan, WEI Zhipeng. Design and Fabrication of High Aspect-ratio Hard X-ray Zone Plates[J]. Opto-Electronic Engineering, 2014, 41(3): 7
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