• Laser & Optoelectronics Progress
  • Vol. 51, Issue 2, 21403 (2014)
Gao Meina*, Wang Xuyue, Xu Wenji, and Guo Dongming
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/lop51.021403 Cite this Article Set citation alerts
    Gao Meina, Wang Xuyue, Xu Wenji, Guo Dongming. Experimental Study on the Stainless-Carbon Steel Laminated Plates Prepared by Laser Cladding[J]. Laser & Optoelectronics Progress, 2014, 51(2): 21403 Copy Citation Text show less

    Abstract

    Due to quality defects on the surface of stainless and carbon steel laminated plates prepared conventionally, laser cladding is introduced for preparing metal laminated plates. By adjusting two main process parameters of the laser power and scanning speed, their influences on the metallographic structure of laminated platesby laser cladding are investigated. Then the parameters are optimized according to metallographic structure analysis and tensile test of stainless-carbon steel laminated plates. The results show that: with the decrease of the energy density of the laser, stainless steel laminated plates interface is arranged in three microstructure morphology, which have wave heights of 0.01~0.03 mm, 0.08~0.10 mm and 0.11~0.14 mm, and the layer thickness increases gradually. Meanwhile, the yield strength increases as the interface wave height increases. When the wave height of the interface of stainless steel laminated plates is 0.11~0.14 mm, thehigh yield strength of 410 MPa is obtained. Stainless-carbon steel laminated plates prepared by laser cladding have strong metallurgy bonding quality and good microstructure properties. The tensile strength and elongation indicators have met the requirements of the standard of stainless-carbon steel laminated plates. This method is feasible, and provides theoretical and experimental basis for the wide application of laser cladding preparation of laminated plates.
    Gao Meina, Wang Xuyue, Xu Wenji, Guo Dongming. Experimental Study on the Stainless-Carbon Steel Laminated Plates Prepared by Laser Cladding[J]. Laser & Optoelectronics Progress, 2014, 51(2): 21403
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