• Infrared and Laser Engineering
  • Vol. 36, Issue 2, 281 (2007)
[in Chinese]1、*, [in Chinese]2, and [in Chinese]1
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  • 1[in Chinese]
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    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese]. Modeling and analysis of thermoelectric cooler by equivalent circuit method[J]. Infrared and Laser Engineering, 2007, 36(2): 281 Copy Citation Text show less
    References

    [3] PHELAN P E,CHIRIAC V A,LEE T-Y T.Current and future miniature refrigeration cooling technologies for high power microelectronics[J].IEEE Transactions on Components and Packaging Technologies,2002,25(3):356-365.

    [4] CHAVEZ J,ORTEGA J,SALAZAR J,et al.Spice model of thermoelectric elements including thermal effects[C]//.Proc Instrumentation and Measurement Technology Conference,2000:1019-1023.

    [5] LINEYKIN S,YAAKOV S B.Analysis of thermoelectric coolers by a spice -compatible equivalent-circuit model[J].IEEE Power Electronics Letters,2005,3(2):63-66.

    [6] HODES M.On one-dimensional analysis of thermoelectric modules (TEMs)[J].IEEE Transactions on Components and Packaging Teehnologies,2005,28(2):218-229.

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    [in Chinese], [in Chinese], [in Chinese]. Modeling and analysis of thermoelectric cooler by equivalent circuit method[J]. Infrared and Laser Engineering, 2007, 36(2): 281
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