Zehong WAN, Hongyang DENG, Yu LEI, Guoyi TAO, Hongpo HU, Shengjun ZHOU. Low-damage Micromachining for 4H-SiC Pressure Sensitive Diaphragm by Femtosecond Laser[J]. Acta Photonica Sinica, 2023, 52(1): 0114004
- Acta Photonica Sinica
- Vol. 52, Issue 1, 0114004 (2023)
Fig. 1. Schematic illustration of the femtosecond laser micromachining system
Fig. 2. Schematic illustration of femtosecond laser processing for 4H-SiC sensitive diaphragm
Fig. 3. Schematic illustration of the profile and light intensity distribution of a Gaussian beam
Fig. 4. Energy distribution of the femtosecond laser
Fig. 5. SEM images of 4H-SiC processed by femtosecond laser for single-line scanning
Fig. 6. SEM images of 4H-SiC with different number of processing laps or ∆H
Fig. 7. Schematic illustration of the superposition of light intensity in different cross-sections with the ∆d of 20 μm
Fig. 8. SEM images for the ablated surface of 4H-SiC with different number of processing laps
Fig. 9. SEM images of 4H-SiC samples processed with different scanning directions
Fig. 10. The dependence of the ablation depth for one lap，light intensity，RMS roughness of the ablated surface，the superposition of light intensity，and RMS roughness per unit ablation depth on laser single pulse energy
Fig. 11. The dependence of the ablation depth for one lap，light intensity，RMS roughness of the ablated surface，the superposition of light intensity，and surface morphology on scanning line interval
Fig. 12. SEM images of 4H-SiC samples processed with different material removal methods
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Table 1. Specifications of the 4H-SiC wafer
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Table 2. Technical parameters of the femtosecond laser micromachining system
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