• Journal of Infrared and Millimeter Waves
  • Vol. 38, Issue 3, 310 (2019)
XIAO Jun1、2, LI Xiu-Ping1、2, QI Zi-Hang1、2, ZHU Hua1、2, and FENG Wei-Wei1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.11972/j.issn.1001-9014.2019.03.009 Cite this Article
    XIAO Jun, LI Xiu-Ping, QI Zi-Hang, ZHU Hua, FENG Wei-Wei. Cavity-backed on-chip patch antenna in 0.13 μm SiGe BiCMOS technology[J]. Journal of Infrared and Millimeter Waves, 2019, 38(3): 310 Copy Citation Text show less

    Abstract

    This letter presents a 340 GHz cavity-backed on-chip patch antenna design and fabrication using standard 0.13 μm SiGe BiCMOS technology. The patch placed at AM layer is fed by a stripline at LY layer through via holes from LY to AM layer. The via holes are built between the top metal layer (AM layer) and the ground plane (M1 layer) to form a cavity which improves the impedance matching bandwidth and the radiation performances of the antenna. The proposed antenna shows a simulated impedance bandwidth of 9.2 GHz from 335.6 to 344.8 GHz for S11 less than -10 dB. The simulated gain of the antenna at 340 GHz is 3.2 dBi. The total area of the antenna is 0.5×0.56 mm2.
    XIAO Jun, LI Xiu-Ping, QI Zi-Hang, ZHU Hua, FENG Wei-Wei. Cavity-backed on-chip patch antenna in 0.13 μm SiGe BiCMOS technology[J]. Journal of Infrared and Millimeter Waves, 2019, 38(3): 310
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