[1] S Mathusalini, K Lakshmi, T Arasakumar et al. Journal of Materials Science: Materials in Electronics, 28, 12944(2017).
[3] Byeonghwang Park, Eugene Chong, Hyun Kim Ju. Journal of the Korea Institute of Military Science and Technology, 17, 8(2014).
[4] Barreca Davide, Gri Filippo, Gasparotto Alberto et al. Advanced Materials Interfaces, 5, 1800792(2018).
[5] Matatagui DANIEL, Sayago ISABEL, Jesús Fernández MARíA et al. Talanta, 148, 393(2016).