• Chinese Journal of Lasers
  • Vol. 50, Issue 4, 0402022 (2023)
Ye Ma1, Cheng Lei1、*, Ting Liang1、**, Pengfei Ji1, Yuqiao Liu1, Bingyan Wang2, and Guofeng Chen2
Author Affiliations
  • 1State Key Laboratory of Dynamic Measurement Technology, North University of China, Taiyuan 030051, Shanxi, China
  • 2Inner Mongolia Power Machinery Institute, Hohhot 010010, Inner Mongolia, China
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    DOI: 10.3788/CJL221348 Cite this Article Set citation alerts
    Ye Ma, Cheng Lei, Ting Liang, Pengfei Ji, Yuqiao Liu, Bingyan Wang, Guofeng Chen. Sapphire Through‐Hole Machining with 355 nm All‐Solid‐State Ultraviolet Nanosecond Laser[J]. Chinese Journal of Lasers, 2023, 50(4): 0402022 Copy Citation Text show less
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    [2] Wang Q W, Zhang Q L, Zhang Z et al. Material removal and surface formation mechanism of C-plane sapphire in multipass ablation by a nanosecond UV laser[J]. Ceramics International, 46, 21461-21470(2020).

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    [23] Kuriakose A, Bollani M, Di Trapani P et al. Study of through-hole micro-drilling in sapphire by means of pulsed Bessel beams[J]. Micromachines, 13, 624(2022).

    Ye Ma, Cheng Lei, Ting Liang, Pengfei Ji, Yuqiao Liu, Bingyan Wang, Guofeng Chen. Sapphire Through‐Hole Machining with 355 nm All‐Solid‐State Ultraviolet Nanosecond Laser[J]. Chinese Journal of Lasers, 2023, 50(4): 0402022
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