• Semiconductor Optoelectronics
  • Vol. 45, Issue 5, 726 (2024)
YANG Wukun1, ZHANG Yumin1,2, SONG Yanming1,2, TIAN Jing1, and WANG Du1,2
Author Affiliations
  • 1Beijing Engineering Research Center of Optoelectronic Information and Instruments, Beijing Information Science & Technology University, Beijing 100192, CHN
  • 2Beijing Laboratory of Optical Fiber Sensing and System, Beijing Information Science & Technology University, Beijing 100016, CHN
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    DOI: 10.16818/j.issn1001-5868.2024052102 Cite this Article
    YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726 Copy Citation Text show less
    References

    [1] Chan T H T, Yu L, Tam H Y, et al. Fiber Bragg grating sensors for structural health monitoring of Tsing Ma bridge: Background and experimental observation[J]. Eng. Struct., 2006, 28(5): 648-659.

    [2] Li H N, Li D S, Song G B. Recent applications of fiber optic sensors to health monitoring in civil engineering[J]. Eng. Struct., Elsevier, 2004, 26(11): 1647-1657.

    [3] Zheng Y, Zhu Z W, Xiao W, et al. Review of fiber optic sensors in geotechnical health monitoring[J]. Opt. Fiber Technol., 2020, 54: 102127.

    [4] Wnuk V P, Mendez A, Ferguson S, et al. Process for mounting and packaging of fiber Bragg grating strain sensors for use in harsh environment applications[J]. Proc. of SPIE, 2005, 5758: 46-53.

    [6] Zhang Y, Zhu L, Luo F, et al. Comparison of metal-packaged and adhesive-packaged fiber Bragg grating sensors[J]. IEEE Sensors J., 2016, 16(15): 5958-5963.

    [7] Fusiek G, Rubert T, Niewczas P, et al. Preliminary characterization of metal-packaged fiber Bragg gratings under fatigue loading[C]// 2017 IEEE International Instrumentation and Measurement Technol. Conf. (I2MTC), 2017: 1-4.

    [13] Erdogan T. Fiber grating spectra[J]. J. Lightwave Technol., 1997, 15(8): 1277-1294.

    YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726
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