• Semiconductor Optoelectronics
  • Vol. 45, Issue 5, 726 (2024)
YANG Wukun1, ZHANG Yumin1,2, SONG Yanming1,2, TIAN Jing1, and WANG Du1,2
Author Affiliations
  • 1Beijing Engineering Research Center of Optoelectronic Information and Instruments, Beijing Information Science & Technology University, Beijing 100192, CHN
  • 2Beijing Laboratory of Optical Fiber Sensing and System, Beijing Information Science & Technology University, Beijing 100016, CHN
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    DOI: 10.16818/j.issn1001-5868.2024052102 Cite this Article
    YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726 Copy Citation Text show less

    Abstract

    A novel temperature sensing structure and packaging process for metal-encapsulated fiber Bragg grating (FBG) temperature sensors were proposed to overcome issues such as aging, creep, and other long-term effects typically seen in traditional adhesive-encapsulated FBG temperature sensors. Finite element analysis was used to design a strain-insensitive sensor. In this new design, glass solder replaced traditional epoxy resin adhesive to secure the FBG to a stainless steel substrate through two-point welding, while a metal shell and silicone rubber provided sealing protection. The FBG temperature sensor demonstrated a temperature sensitivity of 27.46 pm/℃ within the range of -20 to 55 ℃, with a linear fitting degree of 0.999. The sensor exhibited excellent temperature stability and repeatability, achieving a measurement standard deviation of less than 0.003 ℃ across a broader temperature range of 0 to 150 ℃. This packaging structure offers a simple, cost-effective, and easily implementable sensor technology, with promising application prospects in the field of structural health monitoring.
    YANG Wukun, ZHANG Yumin, SONG Yanming, TIAN Jing, WANG Du. Research on Temperature Sensing Characteristics of FBG Packaged with Glass Solder[J]. Semiconductor Optoelectronics, 2024, 45(5): 726
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