• Chinese Journal of Lasers
  • Vol. 45, Issue 1, 101002 (2018)
Ni Yuxi1,2,*, Jing Hongqi1, Kong Jinxia1, Wang Cuiluan1..., Liu Suping1 and Ma Xiaoyu1|Show fewer author(s)
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    DOI: 10.3788/CJL201845.0101002 Cite this Article Set citation alerts
    Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 101002 Copy Citation Text show less
    References

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    [7] Ni Y X, Ma X Y, Jing H Q et al. Finite element analysis of expansion-matched submounts for high-power laser diodes packaging[J]. Journal of Semiconductors, 37, 064005(2016). http://kns.cnki.net/KCMS/detail/detail.aspx?filename=bdtx201606010&dbname=CJFD&dbcode=CJFQ

    [8] Bezotosnyi V V, Krokhin O N, Oleshchenko V A et al. Thermal modelling of high-power laser diodes mounted using various types of submounts[J]. Quantum Electronics, 44, 899-902(2014). http://www.mathnet.ru/eng/qe16056

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    [13] Qiao Y B, Feng S W, Ma X Y et al. Thermal characteristic of GaAs-based laser diodes[J]. Infrared and Laser Engineering, 40, 2134-2137(2011).

    Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 101002
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