Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 101002
- Chinese Journal of Lasers
- Vol. 45, Issue 1, 101002 (2018)
Fig. 1. Schematic of the F-mount package of laser diodes
Fig. 2. (a) Experimental data of temperature coefficient and linearly fitted curve; (b) transient cooling curves; (c) structure function curves of laser diodes
Fig. 3. Electrical-optical characteristics of typical laser diodes
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Table 1. Detailed parameters of the material and structure of COS package
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Table 2. Output characteristics of laser diodes packaged by SiC and AlN respectively at 16 A current injection
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