• Photonics Research
  • Vol. 7, Issue 8, B55 (2019)
Yosuke Nagasawa and Akira Hirano*
Author Affiliations
  • UV Craftory Co., Ltd., 2-305, Fujimidai 2-7-2, Chikusa-ku, Nagoya 464-0015, Japan
  • show less
    DOI: 10.1364/PRJ.7.000B55 Cite this Article Set citation alerts
    Yosuke Nagasawa, Akira Hirano. Review of encapsulation materials for AlGaN-based deep-ultraviolet light-emitting diodes[J]. Photonics Research, 2019, 7(8): B55 Copy Citation Text show less

    Abstract

    This paper reviews and introduces the techniques for boosting the light-extraction efficiency (LEE) of AlGaN-based deep-ultraviolet (DUV: λ<300 nm) light-emitting diodes (LEDs) on the basis of the discussion of their molecular structures and optical characteristics, focusing on organoencapsulation materials. Comparisons of various fluororesins, silicone resin, and nonorgano materials are described. The only usable organomaterial for encapsulating DUV-LEDs is currently considered to be polymerized perfluoro(4-vinyloxy-1-butene) (p-BVE) terminated with a CF3 end group. By forming hemispherical lenses on DUV-LED dies using p-BVE having a CF3 end group with a refractive index of about 1.35, the LEE was improved by 1.5-fold, demonstrating a cost-feasible packaging technique.
    ηWPE=(Ep/Vf)×ηEQE,(1)

    View in Article

    ηEQE=ηCIE×ηIQE×ηLEE.(2)

    View in Article

    2COOHCO+CO2+H2O.(3)

    View in Article

    (CF)+H2O(F)+CFO+H2.(4)

    View in Article

    Yosuke Nagasawa, Akira Hirano. Review of encapsulation materials for AlGaN-based deep-ultraviolet light-emitting diodes[J]. Photonics Research, 2019, 7(8): B55
    Download Citation