Linjie LIU, Yue HAO, Yangfan ZHOU, Ke WANG, Zhizhuang QIAO. Non-vertical ball grid array interconnection of ceramic package for high-performance DC-55 GHz application[J]. Optics and Precision Engineering, 2023, 31(3): 363
- Optics and Precision Engineering
- Vol. 31, Issue 3, 363 (2023)
Fig. 1. Framework of ball grid array package
Fig. 2. Quasi back-to-back model of non-vertical interconnection structure
Fig. 3. Simulation results of non-vertical structures with different misalignment angles
Fig. 4. Simulation results of non-vertical structures with different number of steps
Fig. 5. Simulation results of non-vertical structures with different solder ball radii and pitches
Fig. 6. Optimized result of non-vertical interconnection structure
Fig. 7. Quasi back-to-back physical map of non-vertical interconnection structure
Fig. 8. Test results of non-vertical interconnection structure
Fig. 9. Block diagram of signal transmission simulation structure
Fig. 10. Transmission eye diagrams
Fig. 11. Eye diagrams for the 112 Gb/s PAM4
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